公开(公告)号：US20180332734A1

公开(公告)日：2018-11-15

申请号：US15595765

申请日：2017-05-15

Applicant: Intel Corporation

Inventor： Tozer J. BANDORAWALLA ,  Mark E. SPRENGER

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L21/4882 ,  G06F1/20 ,  H01L23/473 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064

Abstract: Apparatuses, systems and methods associated with design of cold plates for cooling electrical systems are disclosed herein. In embodiments, a cold plate may include a base and a lid affixed to a side of the base via a braze joint, wherein the braze joint may extend around a perimeter of the lid. The lid may include a dam having a perimeter located inside of the perimeter of the lid, wherein the dam may be compressed against the side of the base and may be liquid-tight to the side of the base, and wherein a cavity may be located between the base and the lid within the perimeter of the dam to provide a circulation passage for a liquid coolant. Other embodiments may be described and/or claimed.