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公开(公告)号:US20190244877A1
公开(公告)日:2019-08-08
申请号:US16384494
申请日:2019-04-15
发明人: Phil Slight , Vic Chia
CPC分类号: H01L23/4006 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H05K1/0203 , H05K1/0209 , H05K7/2049 , H05K2201/066 , H05K2201/10242 , H05K2201/10265 , H05K2201/10393 , H05K2201/10409
摘要: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
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公开(公告)号:US20180372306A1
公开(公告)日:2018-12-27
申请号:US15982617
申请日:2018-05-17
申请人: BJB GmbH & Co. KG
发明人: Olaf Baumeister , Markus Pieper
IPC分类号: F21V15/01 , F21V29/503 , H05K1/18 , H05K1/05 , H05K1/02
CPC分类号: F21V15/01 , F21S4/28 , F21V3/02 , F21V5/043 , F21V17/04 , F21V29/503 , F21V29/507 , F21Y2103/10 , F21Y2115/10 , H05K1/0209 , H05K1/05 , H05K1/18 , H05K2201/10106
摘要: A light for room and building illumination, the light comprising an illuminant, including a circuit board including a carrier material, an insulation layer applied to the carrier material at least on one side, conductive paths applied to the insulation layer, and at least one LED that is arranged on the insulation layer and functions as the illuminant, at least one light permeable cover arranged subsequent to the LED in a light exit direction, a light housing in which the circuit board is arranged, characterized in that the circuit board is a metal core circuit board which forms the light housing.
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公开(公告)号:US20180356085A1
公开(公告)日:2018-12-13
申请号:US15684665
申请日:2017-08-23
发明人: Dung Duong
CPC分类号: F21V23/005 , A01G7/045 , F21K9/232 , F21K9/90 , F21S4/28 , F21V7/005 , F21V7/0066 , F21V7/05 , F21V15/015 , F21V17/107 , F21V19/0015 , F21V19/003 , F21V23/001 , F21V23/02 , F21V23/0442 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2103/10 , F21Y2105/16 , F21Y2115/10 , H05B33/0854 , H05B37/0227 , H05B37/0272 , H05K1/0203 , H05K1/0209 , H05K1/0274 , H05K1/0277 , H05K1/05 , H05K1/056 , H05K1/181 , H05K1/182 , H05K1/185 , H05K3/0014 , H05K3/28 , H05K3/32 , H05K3/44 , H05K2201/066 , H05K2201/09009 , H05K2201/10106
摘要: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
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公开(公告)号:US20180356077A1
公开(公告)日:2018-12-13
申请号:US15688358
申请日:2017-08-28
发明人: Dung Duong , Randy Johnson , Nick Klase
IPC分类号: F21V19/00 , F21V17/10 , F21V23/00 , F21V23/02 , F21V29/70 , F21V15/015 , F21S4/28 , H05K1/05
CPC分类号: F21V23/005 , A01G7/045 , F21K9/232 , F21K9/90 , F21S4/28 , F21V7/005 , F21V7/0066 , F21V7/05 , F21V15/015 , F21V17/107 , F21V19/0015 , F21V19/003 , F21V23/001 , F21V23/02 , F21V23/0442 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2103/10 , F21Y2105/16 , F21Y2115/10 , H05B33/0854 , H05B37/0227 , H05B37/0272 , H05K1/0203 , H05K1/0209 , H05K1/0274 , H05K1/0277 , H05K1/05 , H05K1/056 , H05K1/181 , H05K1/182 , H05K1/185 , H05K3/0014 , H05K3/28 , H05K3/32 , H05K3/44 , H05K2201/066 , H05K2201/09009 , H05K2201/10106
摘要: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
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公开(公告)号:US20180348827A1
公开(公告)日:2018-12-06
申请号:US16042804
申请日:2018-07-23
申请人: Apple Inc.
发明人: Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC分类号: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
摘要: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号:US20180266647A1
公开(公告)日:2018-09-20
申请号:US15923541
申请日:2018-03-16
申请人: VALEO ILUMINACION
发明人: Jose-David Roldan , Jose-Ramon Martinez-Perez , Juan-Jose Santaella , Juan Lara-Cabeza , Miguel-Angel Pena , Manuel Calmaestra , Antonio Domingo Illan , Jaime Arjona
CPC分类号: F21S45/48 , F21S43/14 , F21S45/47 , F21S45/49 , F21V19/0015 , F21V29/89 , F21Y2115/10 , H05K1/0209 , H05K2201/066 , H05K2201/10106
摘要: Lighting module for an automotive vehicle, comprising: a printed circuit board; and heat dissipation means comprising at least one metallic sheet; the at least one metallic sheet is stuck on the printed circuit board and the at least one metallic sheet comprises at least a first portion and a second portion which are not coplanar with each other. And a method for producing a lighting module for an automotive vehicle, comprising: providing a printed circuit board; providing heat dissipation means comprising at least one metallic sheet; shaping the at least one metallic sheet into at least a first portion and a second portion which are not coplanar with each other; and sticking the at least one metallic sheet on the printed circuit board.
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公开(公告)号:US10062633B2
公开(公告)日:2018-08-28
申请号:US15549243
申请日:2016-01-29
申请人: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人: Shungo Hiratani , Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Hideo Morioka , Arinobu Nakamura
IPC分类号: H01L23/50 , H01L23/367 , H01L25/07
CPC分类号: H01L23/3675 , H01L23/36 , H01L23/50 , H01L25/072 , H05K1/0209 , H05K1/183 , H05K7/209 , H05K2201/066 , H05K2201/10166
摘要: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.
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公开(公告)号:US20180233860A1
公开(公告)日:2018-08-16
申请号:US15892743
申请日:2018-02-09
申请人: LOTES CO., LTD
发明人: Chin Chi Lin , Cheng Wei Lo
IPC分类号: H01R13/66 , H01R13/506 , H01R12/57 , H01R12/53 , H01R13/516 , H05K1/02
CPC分类号: H01R13/6591 , H01L23/3675 , H01R12/53 , H01R12/57 , H01R12/716 , H01R12/725 , H01R12/732 , H01R13/405 , H01R13/506 , H01R13/516 , H01R13/5213 , H01R13/5216 , H01R13/6581 , H01R13/6594 , H01R13/665 , H05K1/0203 , H05K1/0209 , H05K3/284 , H05K7/20154 , H05K7/2039 , H05K2201/0215 , H05K2201/10189 , H05K2201/10371 , H05K2201/10446
摘要: An electrical connector assembly includes: a circuit board; a connector, located in front of the circuit board and electrically connected to the circuit board; a chip, provided on the circuit board, and electrically connected to the circuit board; a metal shell, covering the connector and the circuit board; and an inner film, made of a high heat conductive material, and wrapping the chip and the circuit board. At least a part of the inner film is located between the metal shell and the circuit board. When the chip generates a great amount of heat, the inner film, serving as a medium, can absorb the heat rapidly and conduct the heat to the metal shell so as to dissipate the heat outside.
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公开(公告)号:US20180211848A1
公开(公告)日:2018-07-26
申请号:US15696346
申请日:2017-09-06
发明人: Yi-Feng Pu , Po-Yu Cheng , Tzu-Shu Lin
CPC分类号: H01L21/565 , H01L21/56 , H01L23/3121 , H01L23/3135 , H05K1/0209 , H05K1/185 , H05K3/1275 , H05K3/1283 , H05K3/284 , H05K3/30 , H05K2203/1105 , H05K2203/1377
摘要: An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.
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10.
公开(公告)号:US20180177038A1
公开(公告)日:2018-06-21
申请号:US15577866
申请日:2016-12-08
申请人: LG Chem, Ltd.
发明人: Seung Kyu YOON , Jun Young BANG
CPC分类号: H05K1/0203 , H02J7/0068 , H02J7/02 , H02J7/04 , H05K1/0209 , H05K1/0265 , H05K1/11 , H05K1/181 , H05K3/24 , H05K7/20 , H05K2201/066 , H05K2201/10166
摘要: The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.
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