公开(公告)号：US11581272B2

公开(公告)日：2023-02-14

申请号：US16394537

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Richard Dischler ,  Johanna M. Swan ,  Victor J. Prokoff

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200303328A1

公开(公告)日：2020-09-24

申请号：US16394537

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Richard Dischler ,  Johanna M. Swan ,  Victor J. Prokoff

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.