公开(公告)号：US20230083610A1

公开(公告)日：2023-03-16

申请号：US17474938

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Aditi Mallik ,  Pengyue Wen ,  Quan Tran ,  Wendai Wang ,  Xiaozhong Wang

IPC: G02B6/12 ,  H04B10/40

Abstract: Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.