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公开(公告)号:US20230083610A1
公开(公告)日:2023-03-16
申请号:US17474938
申请日:2021-09-14
Applicant: Intel Corporation
Inventor: Aditi Mallik , Pengyue Wen , Quan Tran , Wendai Wang , Xiaozhong Wang
Abstract: Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.
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公开(公告)号:US12183650B2
公开(公告)日:2024-12-31
申请号:US17131642
申请日:2020-12-22
Applicant: Intel Corporation
Inventor: Aditi Mallik , Chen Zhuang , Raghuram Narayan
IPC: H01L23/10 , H01L23/367 , H01L23/373
Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.
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