公开(公告)号：US20230083610A1

公开(公告)日：2023-03-16

申请号：US17474938

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Aditi Mallik ,  Pengyue Wen ,  Quan Tran ,  Wendai Wang ,  Xiaozhong Wang

IPC: G02B6/12 ,  H04B10/40

Abstract: Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.

公开(公告)号：US12183650B2

公开(公告)日：2024-12-31

申请号：US17131642

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Aditi Mallik ,  Chen Zhuang ,  Raghuram Narayan

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373

Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.