METHODS AND APPARATUS FOR REDUCING RELIABILITY DEGRADATION ON AN INTEGRATED CIRCUIT

    公开(公告)号:US20210383049A1

    公开(公告)日:2021-12-09

    申请号:US17406534

    申请日:2021-08-19

    Abstract: An integrated circuit with programmable logic circuitry is provided. The integrated circuit may include quiet regions, toggling regions, or unused regions. An integrated circuit may also include heavily-used metal routing paths, lightly-used metal routing paths, and unused metal routing paths. Circuit design tools may be used to generate multiple configuration images that replace the quiet regions with toggling or unused regions, that swap the heavily-used metal routing paths with lightly-used or unused metal routing paths, or that use random fitter seeds of improve the usage coverage to statistically reduce the always quiet regions on the integrated circuit. The multiple configuration images implement the same design and can be used to reconfigure the integrated circuit upon startup to reduce aging effects and improve circuit performance.

    METHODS AND APPARATUS FOR REDUCING RELIABILITY DEGRADATION ON AN INTEGRATED CIRCUIT

    公开(公告)号:US20190095571A1

    公开(公告)日:2019-03-28

    申请号:US15718685

    申请日:2017-09-28

    Abstract: An integrated circuit with programmable logic circuitry is provided. The integrated circuit may include quiet regions, toggling regions, or unused regions. An integrated circuit may also include heavily-used metal routing paths, lightly-used metal routing paths, and unused metal routing paths. Circuit design tools may be used to generate multiple configuration images that replace the quiet regions with toggling or unused regions, that swap the heavily-used metal routing paths with lightly-used or unused metal routing paths, or that use random fitter seeds of improve the usage coverage to statistically reduce the always quiet regions on the integrated circuit. The multiple configuration images implement the same design and can be used to reconfigure the integrated circuit upon startup to reduce aging effects and improve circuit performance.

    Timing Model for Chip-to-Chip Connection in a Package

    公开(公告)号:US20240028815A1

    公开(公告)日:2024-01-25

    申请号:US18375299

    申请日:2023-09-29

    CPC classification number: G06F30/398 G06F2119/12

    Abstract: Integrated circuit devices, methods, and circuitry are provided for performing timing analysis for chip-to-chip connections between integrated circuits in a multichip package. A system may include an integrated circuit package and a computing system. The integrated circuit package may have a first integrated circuit connected to a second integrated circuit via a chip-to-chip connection. The chip-to-chip connection may also be connected to a package ball. The computing system may perform timing analysis on a circuit design for the first integrated circuit with respect the chip-to-chip connection based on user-specified parasitic data relating to the connection to the package ball.

    Methods and apparatus for reducing reliability degradation on an integrated circuit

    公开(公告)号:US11113442B2

    公开(公告)日:2021-09-07

    申请号:US15718685

    申请日:2017-09-28

    Abstract: An integrated circuit with programmable logic circuitry is provided. The integrated circuit may include quiet regions, toggling regions, or unused regions. An integrated circuit may also include heavily-used metal routing paths, lightly-used metal routing paths, and unused metal routing paths. Circuit design tools may be used to generate multiple configuration images that replace the quiet regions with toggling or unused regions, that swap the heavily-used metal routing paths with lightly-used or unused metal routing paths, or that use random fitter seeds of improve the usage coverage to statistically reduce the always quiet regions on the integrated circuit. The multiple configuration images implement the same design and can be used to reconfigure the integrated circuit upon startup to reduce aging effects and improve circuit performance.

Patent Agency Ranking