公开(公告)号：US20240314973A1

公开(公告)日：2024-09-19

申请号：US18671881

申请日：2024-05-22

Applicant: Intel Corporation

Inventor： Chen ZHANG ,  Xiang QUE ,  Yang YAO ,  Yuehong FAN ,  Guangying ZHANG ,  Liguang DU ,  Shaorong ZHOU ,  Chuanlou WANG ,  Yingqiong BU ,  Yue YANG

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20236 ,  H05K1/0203 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20409 ,  H05K7/20763 ,  H05K7/20263

Abstract: An apparatus is described that includes an immersion bath chamber and a cover that is to seal the immersion bath chamber. An apparatus is described that includes an immersion bath chamber and an installable/removable transfer member. The installable/removable transfer member has fluidic connectors designed to couple to respective warmed fluid flow output ports of pluggable units to be cooled in the immersion bath chamber and having respective backplane interface designs. An apparatus is described that includes an immersion bath chamber and an overflow chamber. The overflow chamber is to receive an overflow of liquid coolant from the immersion bath chamber, wherein a first exit flow channel from the overflow chamber is coupled to a second exit fluid flow channel from the immersion bath chamber through a valve, wherein, an opening of the valve is controllable to vary a gravitational fluid flow within the immersion bath chamber.