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公开(公告)号：US12133358B2
公开(公告)日：2024-10-29
申请号：US17979947
申请日：2022-11-03
申请人： DENSO CORPORATION
发明人： Yuya Saito , Yuuki Suzuki , Yuusuke Toda , Takeshi Okinotani
CPC分类号： H05K7/20263 , F28F13/08 , H05K7/2039
摘要： A heat exchanger includes a plurality of fins that are spaced from each other and are arranged to divide a heat medium flow passage into a plurality of narrow passages. Each fin incudes a plurality of thick wall portions and a plurality of thin wall portions which are alternately arranged in a passage longitudinal direction. Each adjacent two of the plurality of fins, which are adjacent to each other, are defined as one fine and another fin, and each of the plurality of thick wall portions of the one fin is opposed to an adjacent one of the plurality of thin wall portions of the another fin in a fin arrangement direction, and each of the plurality of thin wall portions of the one fin is opposed to an adjacent one of the plurality of thick wall portions of the another fin in the fin arrangement direction.
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公开(公告)号：US20240357776A1
公开(公告)日：2024-10-24
申请号：US18759193
申请日：2024-06-28
发明人： Tangbo Jing , Jian Wang
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20263 , H05K7/20272
摘要： The disclosure relates to a data center, including: an IT equipment container provided with a server rack therein, an air-cooling equipment container, the IT equipment container having IT coolant inlet and outlet ports, and IT air inlet and outlet ports, the IT equipment container being prefabricated with a coolant inlet pipe connecting the IT coolant inlet port to a coolant inlet of a server rack, a coolant outlet pipe connecting the IT coolant outlet port to a coolant outlet of the server rack, and an air duct connecting the IT air outlet port to an air outlet of the server rack, and the IT air inlet port being in communication with interior of the IT equipment container; and having air-cooling air inlet and outlet ports, the air-cooling air inlet port and outlet ports being docked with the IT air outlet port and the IT air inlet port, respectively.
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公开(公告)号：US20240343962A1
公开(公告)日：2024-10-17
申请号：US18291496
申请日：2022-07-21
申请人： BASF SE
CPC分类号： C09K5/10 , H05K7/20236 , H05K7/20263 , H05K7/20281 , H05K7/20763
摘要： Coolants with low electrical conductivity can be used in direct or indirect cooling of electronic devices. The coolant has at least one glycol, water, at least one azole derivative, at least one ester of orthosilicic acid or alkoxy alkylsilane, optionally at least one tertiary amine bearing at least one 2-hydroxyethyl- or 2-hydroxypropyl-group, optionally at least one monocarboxylic acid, optionally at least one silicophosphonate, and optionally at least one further coolant additive.
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公开(公告)号：US12120854B2
公开(公告)日：2024-10-15
申请号：US17547701
申请日：2021-12-10
申请人： Ciena Corporation
IPC分类号： H05K7/20
CPC分类号： H05K7/20736 , H05K7/202 , H05K7/20263
摘要： A networking hardware system includes a housing; a board located in the housing and comprising a plurality of components; a liquid cooled heat exchanger; and one or more fans disposed near the liquid cooled heat exchanger and configured to provide cool airflow from the liquid cooled heat exchanger to any of the plurality of components. The housing can be substantially sealed from an external environment and includes no air intake thereon, removing a need for higher powered fans and for air filtering for dust. The housing can include a faceplate with no air intake thereon, providing increased density for ports on the faceplate.
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公开(公告)号：US12120845B2
公开(公告)日：2024-10-15
申请号：US18147672
申请日：2022-12-28
发明人： Yi-Hsin Huang , Chun-Lung Wu , Kuo-Wei Lee , Tze-Yang Yeh
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , H05K7/20409
摘要： A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.
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公开(公告)号：US12096606B2
公开(公告)日：2024-09-17
申请号：US17704743
申请日：2022-03-25
发明人： Shailesh N. Joshi , Hiroshi Ukegawa
CPC分类号： H05K7/20927 , H02K9/06 , H05K7/20254 , H05K7/20263 , H05K7/20272
摘要： A hybrid cooling system of an electric machine is contemplated. The hybrid cooling system includes a propeller assembly comprising a propeller, a housing comprising a stator and a rotor coupled to the propeller, and one or more capacitors, a gate drive electronics board, a cold plate, a substrate, power electronics coupled to substrate and the cold plate, a pump for pumping liquid coolant, and a heat exchanger. The liquid coolant from the pump contacts the gate drive electronics board, the cold plate, the substrate, and the power electronics for cooling the gate drive electronics board, the cold plate, the substrate, and the power electronics, and the propeller is configured to generate air that cools the stator and the rotor.
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公开(公告)号：US20240306344A1
公开(公告)日：2024-09-12
申请号：US18598691
申请日：2024-03-07
发明人： Dietmar Mann , Stefan Djuranec , Jochen Müller
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , H05K7/20209 , H05K7/20781
摘要： An air-to-liquid cooling system includes a cabinet, a fluid inlet, a fluid outlet, a heat exchanger within the cabinet, a plurality of fan assemblies, and a hot-swappable control module. The cabinet defines a front and rear portion, and includes lateral side panels and a front face. The heat exchanger is in fluid communication with the fluid inlet and fluid outlet. The heat exchanger is positioned at an oblique angle relative to the lateral side panels of the cabinet. The plurality of fan assemblies are mounted along the front face and further include a fan and blind mate connectors. The hot-swappable control module is positioned vertically above the plurality of fan assemblies. The hot-swappable control module includes a controller that is in electronic communication with the plurality of fan assemblies, and includes instructions stored within the controller to control a speed of the fans.
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公开(公告)号：US20240305236A1
公开(公告)日：2024-09-12
申请号：US18588685
申请日：2024-02-27
申请人： OVH
发明人： Mohamad HNAYNO , Ali CHEHADE
CPC分类号： H02S10/30 , H05K7/20263 , H05K7/20772 , H05K7/20781
摘要： A cooling system and a method for cooling an electronic device are disclosed. The electronic device includes a heat-generating component. The cooling arrangement includes an immersion casing that contains a dielectric cooling liquid, the electronic device being, at least in part, immersed in the dielectric cooling liquid such that the dielectric cooling liquid collects, in use, at least a first portion of a thermal energy generated by the heat-generating component, and a photovoltaic device proximate to the immersion casing and configured to convert at least in part a second portion of the thermal energy generated by the heat-generating component into electric energy, the second portion having radiated from the dielectric cooling liquid and through the immersion casing.
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公开(公告)号：US20240237308A1
公开(公告)日：2024-07-11
申请号：US18407994
申请日：2024-01-09
申请人： Carrier Corporation
发明人： Arindom Joardar , Richard Lord , Michel Grabon , Tobias Sienel , My Dinh Truong , Tikhon Suresh Pichai
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20136 , H05K7/20263 , H05K7/20309 , H05K7/20818
摘要： A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device includes cooling the at least one heat-generating electronic device with a primary cooling fluid and cooling the at least one heat-generating electronic device and the at least one peripheral heat-generating device with a secondary cooling fluid. The secondary cooling fluid is distinct from the primary cooling fluid.
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公开(公告)号：US12029009B1
公开(公告)日：2024-07-02
申请号：US18346576
申请日：2023-07-03
申请人： UIPCO, LLC
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , H05K7/20781
摘要： A cooling system configured to remove heat from a chimney of a server cabinet. The cooling system including a first chimney portion adjacent to the server cabinet, a second chimney portion extending from a top of the first chimney portion, wherein the second chimney portion is disposed above the server cabinet, a chimney heat exchanger disposed in the second chimney portion and above the server cabinet, a fluid inlet for providing a working fluid to the chimney heat exchanger, a fluid outlet for discharging the working fluid from the chimney heat exchanger, and an air handler heat exchanger connected to the chimney heat exchanger by a return air plenum, wherein the chimney heat exchanger has an upstream surface that receives waste heat generated by a server disposed in the server cabinet and a downstream surface that discharges air to the return air plenum.
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