摘要:
The burn-in test device has a multiplicity of test receptacles (101, 102, 103, 104 . . . ) in a test board for receiving semiconductor memories. The test board is wired alternately in such a way that burn-in pulses can be applied to the semiconductor modules in dependence on its organization, with the result that the burn-in pulses are applied in each case to the total number of input/output lines.
摘要:
A burn-in system uses a board for testing modules disposed like a matrix in the board. A circuit configuration includes module terminals for the modules in the board. Input/output channels are each connected to a respective one of the module terminals. Diodes are each connected to a respective one of the input/output channels. A scan signal terminal is connected to the diodes for activating the module terminals in groups with scan signals.