公开(公告)号：US20130069427A1

公开(公告)日：2013-03-21

申请号：US13583185

申请日：2011-03-11

申请人： Jens Nowotnick ,  Michael Heim ,  Stefan Keil ,  Peter Rehbein ,  Gerhard Braun ,  Georg Voegele ,  Sigmund Braun ,  Andreas Kulik

发明人： Jens Nowotnick ,  Michael Heim ,  Stefan Keil ,  Peter Rehbein ,  Gerhard Braun ,  Georg Voegele ,  Sigmund Braun ,  Andreas Kulik

IPC分类号： H05K7/14 ,  H05K5/02 ,  H05K7/20 ,  B60L1/00

CPC分类号： H05K3/202 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1815 ,  H05K1/0203 ,  H05K3/0058 ,  H05K5/0034 ,  H05K5/0069 ,  H05K2201/10765 ,  H05K2201/10924 ,  H05K2203/1316 ,  H05K2203/1322

摘要： The invention relates to a circuit arrangement (1) comprising an electrical and/or electronic circuit unit (10), which comprises a circuit carrier (14), on which at least one electrical and/or electronic component (12) is arranged, and at least one connection region (5) with at least one contact unit (14.2) for electrically contact-connecting the electrical and/or electronic circuit unit (10) to other electrical and/or electronic structural units, wherein at least one region of the circuit unit (10) is arranged in a housing unit (20) sealed relative to the surroundings. According to the invention, the housing unit (20) comprises a protective compound which surrounds the at least one region of the circuit unit (10) in a sealing fashion and surrounds the at least one connection region (5) in such a way that the at least one contact unit (14.2) is embedded at least at its side areas into the protective compound (22).

摘要翻译： 本发明涉及一种包括电和/或电子电路单元（10）的电路装置（1），该电路和/或电子电路单元（10）包括电路载体（14），至少一个电和/或电子部件（12）布置在该电路单元上， 至少一个具有至少一个接触单元（14.2）的连接区域（5），用于将电气和/或电子电路单元（10）电接触连接到其它电气和/或电子结构单元，其中至少一个区域 电路单元（10）布置在相对于周围环境密封的壳体单元（20）中。 根据本发明，壳体单元（20）包括保护性化合物，其围绕电路单元（10）的至少一个区域以密封方式包围至少一个连接区域（5），使得 至少一个接触单元（14.2）至少在其侧部区域被嵌入保护化合物（22）中。

公开(公告)号：US06665185B1

公开(公告)日：2003-12-16

申请号：US10267964

申请日：2002-10-09

申请人： Andreas Kulik ,  Andrew Roemer

发明人： Andreas Kulik ,  Andrew Roemer

IPC分类号： H05K720

CPC分类号： H05K1/0272 ,  Y10T428/24562 ,  Y10T428/24744

摘要： A circuit board cooler employs a closed fluid delivery system to transfer heat from electronic components to a cooling fluid. One or more channels embedded within the circuit board carry cooling fluid to the components where the fluid absorbs heat from the component, then away from the component to deposit the excess thermal energy in a thermal sink, such as a heat exchanger. The cooling system may employ conductive thermal transfer elements, such as “thermal vias”, to enhance heat transfer from electronic components to the cooling fluid.

摘要翻译： 电路板冷却器采用封闭的流体输送系统将热量从电子元件传递到冷却流体。 嵌入在电路板内的一个或多个通道将冷却流体携带到流体从部件吸收热量的组件，然后远离组件以将过量的热能存储在诸如热交换器的散热器中。 冷却系统可以采用诸如“热通孔”之类的导电热传递元件，以增强从电子部件到冷却流体的热传递。