公开(公告)号：US09451701B2

公开(公告)日：2016-09-20

申请号：US14594083

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

公开(公告)号：US20160021747A1

公开(公告)日：2016-01-21

申请号：US14333774

申请日：2014-07-17

Applicant: DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.

Inventor： KIN YEAN CHOW

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/181 ,  H05K3/308 ,  H05K3/328 ,  H05K2201/10015 ,  H05K2201/10803 ,  H05K2201/10856 ,  H05K2201/10901 ,  H05K2201/10924 ,  H05K2203/107

Abstract: A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to interconnect the component to the printed circuit board. The lead is formed to define an opening through the lead. The lead is placed into the plated thru-hole such that at least part of the opening is within the plated thru-hole. The lead is laser welded to the plated thru-hole.

Abstract translation: 电路板组件包括印刷电路板和部件。 印刷电路板包括穿过印刷电路板的电镀通孔。 该部件包括用于将部件与印刷电路板互连的引线。 引线形成为通过引线定义开口。 引线被放置在电镀通孔中，使得开口的至少一部分在电镀通孔内。 铅被激光焊接到电镀通孔上。

公开(公告)号：US08837168B2

公开(公告)日：2014-09-16

申请号：US13754910

申请日：2013-01-31

Applicant: Cyntec Co., Ltd.

Inventor： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC: H05K7/18 ,  H05K3/30 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/29 ,  H05K9/00 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01F27/02 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

公开(公告)号：US20140174790A1

公开(公告)日：2014-06-26

申请号：US14191613

申请日：2014-02-27

Applicant: YAZAKI CORPORATION

Inventor： Mamoru SAWAI

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H05K1/056 ,  H05K3/40 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/09754 ,  H05K2201/10924 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

Abstract translation: 布线基板包括具有主面和大致垂直于主面的侧面的布线板; 形成在布线基板的主面上的电路图案; 浸渍板，其布置在所述布线板的中间层中; 并且多个突出端子设置在中间层中并且从侧面向外突出。 突出端子在中间层中彼此电连接。

公开(公告)号：US08547709B2

公开(公告)日：2013-10-01

申请号：US12705389

申请日：2010-02-12

Applicant: Han-Hsiang Lee ,  Kun-Hong Shih ,  Jeng-Jen Li

Inventor： Han-Hsiang Lee ,  Kun-Hong Shih ,  Jeng-Jen Li

IPC: H05K5/02 ,  H05K7/00

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract translation: 将由安装在引线框架上的电路板制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，相对低的发热电子部件适于安装在电路板上。 金属线用于IC芯片的电路和电路板之间的电耦合。 具有复合基板的电子系统具有两个优点 - 电路板具有良好的电路布置能力和来自引线框架的良好热分布。

公开(公告)号：US08203168B2

公开(公告)日：2012-06-19

申请号：US12888174

申请日：2010-09-22

Applicant: Felix Schinner ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

Inventor： Felix Schinner ,  Christian Joos ,  Wolfgang Hauser ,  Michael Schmidt ,  Thomas Burke

IPC: H01L33/00

CPC classification number: H05K3/3442 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/202 ,  H05K2201/10636 ,  H05K2201/10787 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

Abstract translation: 本发明涉及具有半导体元件，特别是半导体芯片的电子部件，以及至少一个SMD元件，具有支撑平台的芯片载体和连接引线。 由此通过芯片连接电连接到连接引线的键指的半导体部件安装在支撑平台上，并且SMD部件通过布置在其上的接触表面将支撑平台连接到连接引线，壳体包围半导体 组件，SMD组件，并且至少部分地是芯片载体。 在SMD部件的区域中的支撑平台和连接引线被成型以形成阻挡层，使得自由流动的材料从连接到芯片载体的SMD部件的接触表面流到支撑平台上， 阻止连接引线。

公开(公告)号：US08179688B2

公开(公告)日：2012-05-15

申请号：US12923968

申请日：2010-10-19

Applicant: Yutaka Fukuda ,  Mitsuhiro Saitou ,  Toshihiro Nagaya ,  Kan Kinouchi ,  Sadahiro Akama ,  Koji Numazaki ,  Norihisa Imaizumi

Inventor： Yutaka Fukuda ,  Mitsuhiro Saitou ,  Toshihiro Nagaya ,  Kan Kinouchi ,  Sadahiro Akama ,  Koji Numazaki ,  Norihisa Imaizumi

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/142 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0263 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

Abstract translation: 电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器 以及设置在散热器的一侧的第一布线板和第二布线板。 第二电元件中的大电流大于第一电元件中的大电流。 第一布线板和第二布线板彼此分离。 第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。

公开(公告)号：US20120084977A1

公开(公告)日：2012-04-12

申请号：US13268252

申请日：2011-10-07

Applicant: Seung Wook PARK ,  Young Do KWEON ,  Ju Pyo HONG ,  Seung Wan SHIN ,  Kyung Seob OH

Inventor： Seung Wook PARK ,  Young Do KWEON ,  Ju Pyo HONG ,  Seung Wan SHIN ,  Kyung Seob OH

IPC: H05K3/30

CPC classification number: H05K3/284 ,  H01L23/49531 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K3/202 ,  H05K3/363 ,  H05K2201/0715 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/4913

Abstract: Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple.

Abstract translation: 本文公开了一种制造块模块的方法，包括：将电子部件安装在其上形成有接地端子的基底基板上; 形成引线框架，从接地端子延伸到基底基板的外部; 将柔性印刷电路连接到基底基板上的电路层; 形成包围所述基底基板的模具; 切割引线框架并将引线框架的切割表面暴露于模具的外部; 并且形成与模具上的引线框架连接的金属涂层，由此形成金属涂层以围绕模具以中断电磁波，并且金属涂层通过引线框架连接到接地端子，以使该工艺 简单。

公开(公告)号：US20120018187A1

公开(公告)日：2012-01-26

申请号：US13263629

申请日：2010-03-29

Applicant: Lorenz Berchtold

Inventor： Lorenz Berchtold

IPC: H05K5/02 ,  H01R43/00

CPC classification number: H05K3/202 ,  H01L21/4821 ,  H01L23/49537 ,  H01L23/49579 ,  H01L2924/0002 ,  H05K2201/0391 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00

Abstract: With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.

Abstract translation: 通过本发明，提供了电子壳体的导体栅格和这种导体栅格的制造方法。 根据本发明，导体栅格由沿着接合边缘（150）焊接的两个金属条（130,110,140）制成，只有两个金属条中的一个需要具有适于引线接合的表面。 以这种方式可以显着减少常规使用的镀覆起始材料的量。

公开(公告)号：US07957158B2

公开(公告)日：2011-06-07

申请号：US11928782

申请日：2007-10-30

Applicant: Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Katsuyoshi Mino

Inventor： Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Katsuyoshi Mino

IPC: H05K7/10

CPC classification number: H01L23/49531 ,  H01L21/565 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.

Abstract translation: 提供了具有改进的包装密度的电路装置。 本发明的电路装置包括：电路板，其表面被绝缘层覆盖; 形成在绝缘层的表面上的导电图案; 电连接到导电图案的电路元件; 并且连接到由导电图案形成的焊盘的引线。 此外，控制元件固定到由引线的一部分形成的台面部的上表面，并且台肩部的后表面与电路板的上表面间隔开。