Semiconductor structure, semiconductor memory device and method of manufacturing the same
    4.
    发明申请
    Semiconductor structure, semiconductor memory device and method of manufacturing the same 审中-公开
    半导体结构,半导体存储器件及其制造方法

    公开(公告)号:US20080099828A1

    公开(公告)日:2008-05-01

    申请号:US11589304

    申请日:2006-10-30

    IPC分类号: H01L29/792 H01L21/336

    摘要: A semiconductor memory device includes a semiconductor substrate, first conductive lines, second conductive lines, and memory cells. The second conductive lines include doped regions within the substrate and have a ratio of depth to width that is greater than unity. A semiconductor structure comprises a semiconductor substrate, a doped region and a charge trapping region beneath and adjoining the doped region. A semiconductor memory device comprises a semiconductor substrate, first conductive lines, second conductive lines, charge trapping regions, and memory cells. The second conductive lines are formed as doped regions within the substrate, wherein the charge trapping regions are arranged beneath and adjoin respective doped regions. Methods of manufacturing a semiconductor structure and a semiconductor memory device are provided.

    摘要翻译: 半导体存储器件包括半导体衬底,第一导电线,第二导线和存储单元。 第二导线包括衬底内的掺杂区域,其深度与宽度之比大于1。 半导体结构包括半导体衬底,掺杂区域和掺杂区域下方和邻接的电荷捕获区域。 半导体存储器件包括半导体衬底,第一导线,第二导线,电荷俘获区和存储单元。 第二导电线被形成为衬底内的掺杂区域,其中电荷俘获区域被布置在相应的掺杂区域的下面并与其相邻。 提供了制造半导体结构和半导体存储器件的方法。