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1.发明申请ELECTRONICS MODULE, ENCLOSURE ASSEMBLY HOUSING SAME, AND RELATED SYSTEMS AND METHODS 有权电子模块，外壳组件外壳以及相关系统和方法公开(公告)号：US20100046175A1
公开(公告)日：2010-02-25
申请号：US12141773
申请日：2008-06-18
CPC分类号： H05K7/1442 , F42B15/01 , F42B30/006 , Y10T29/49826
摘要： Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.
摘要翻译： 本发明的各种实施例涉及电子模块，容纳至少一个这样的电子模块的外壳组件和可以使用这种外壳组件的系统（例如，导弹或无人驾驶的车辆）。 在一个实施例中，电子模块包括大体上在第一平面中延伸的第一板和与第一板间隔开并且大致在第二平面中延伸的第二板。 电子模块还包括多个电子板组件，每个电子板组件大体上在相应平面中延伸并且与第一和第二板中的至少一个热连通。 每个电子板组件可以定位在第一板和第二板之间并且被定向成使得其相应平面相对于第一和第二平面不平行。
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2.发明授权Enclosure assembly housing at least one electronic board assembly and systems using same 有权外壳组件容纳至少一个电子板组件和使用其的系统公开(公告)号：US08773864B2
公开(公告)日：2014-07-08
申请号：US12141799
申请日：2008-06-18
IPC分类号： H05K5/00
CPC分类号： H05K7/1434
摘要： Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface defining an interior space and an inner diameter. At least one electronic board assembly is positioned within the interior space and includes a first peripheral edge region and an opposing second peripheral edge region. The electronic board assembly extends diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface. In another embodiment, a plurality of electronic board assemblies are positioned within the interior space and each extends generally along a respective non-diametric chord defined by the interior surface.
摘要翻译： 本发明的各种实施例涉及容纳至少一个电子板组件和可以采用这种外壳组件的系统（例如，导弹或无人驾驶车辆）的外壳组件。 在一个实施例中，外壳组件包括具有限定内部空间和内径的内表面的外壳。 至少一个电子板组件位于内部空间内，并且包括第一周边边缘区域和相对的第二周边边缘区域。 电子板组件沿径向延伸，使得第一和第二周边边缘区域至少靠近内表面。 在另一个实施例中，多个电子板组件定位在内部空间内，并且每个电子板组件大致沿着由内表面限定的相应的非直径弦延伸。
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3.发明授权Electronics module, enclosure assembly housing same, and related systems and methods 有权电子模块，外壳组件外壳相同，以及相关系统和方法公开(公告)号：US08189345B2
公开(公告)日：2012-05-29
申请号：US12141773
申请日：2008-06-18
IPC分类号： H05K7/14
CPC分类号： H05K7/1442 , F42B15/01 , F42B30/006 , Y10T29/49826
摘要： Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.
摘要翻译： 本发明的各种实施例涉及电子模块，容纳至少一个这样的电子模块的外壳组件和可以使用这种外壳组件的系统（例如，导弹或无人驾驶的车辆）。 在一个实施例中，电子模块包括大体上在第一平面中延伸的第一板和与第一板间隔开并且大致在第二平面中延伸的第二板。 电子模块还包括多个电子板组件，每个电子板组件大体上在相应平面中延伸并且与第一和第二板中的至少一个热连通。 每个电子板组件可以定位在第一板和第二板之间并且被定向成使得其相应平面相对于第一和第二平面不平行。
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4.发明申请ENCLOSURE ASSEMBLY HOUSING AT LEAST ONE ELECTRONIC BOARD ASSEMBLY AND SYSTEMS USING SAME 有权外壳装配最少一个电子板组件和系统使用相同公开(公告)号：US20100046177A1
公开(公告)日：2010-02-25
申请号：US12141799
申请日：2008-06-18
IPC分类号： H05K5/00
CPC分类号： H05K7/1434
摘要： Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface defining an interior space and an inner diameter. At least one electronic board assembly is positioned within the interior space and includes a first peripheral edge region and an opposing second peripheral edge region. The electronic board assembly extends diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface. In another embodiment, a plurality of electronic board assemblies are positioned within the interior space and each extends generally along a respective non-diametric chord defined by the interior surface.
摘要翻译： 本发明的各种实施例涉及容纳至少一个电子板组件和可以采用这种外壳组件的系统（例如，导弹或无人驾驶车辆）的外壳组件。 在一个实施例中，外壳组件包括具有限定内部空间和内径的内表面的外壳。 至少一个电子板组件位于内部空间内，并且包括第一周边边缘区域和相对的第二周边边缘区域。 电子板组件沿径向延伸，使得第一和第二周边边缘区域至少靠近内表面。 在另一个实施例中，多个电子板组件定位在内部空间内，并且每个电子板组件大致沿着由内表面限定的相应的非直径弦延伸。
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