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公开(公告)号：US09660608B2
公开(公告)日：2017-05-23
申请号：US14279845
申请日：2014-05-16
Applicant: K&L Microwave, Inc.
Inventor： Rafi Hershtig
CPC classification number: H03H7/46 , H01G4/00 , H01G4/02 , H01G7/00 , H03H7/0115 , H03H2001/0014 , H05K1/181 , Y10T29/417 , Y10T29/43
Abstract: A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.
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公开(公告)号：US20140247535A1
公开(公告)日：2014-09-04
申请号：US14279845
申请日：2014-05-16
Applicant: K&L Microwave, Inc.
Inventor： Rafi Hershtig
CPC classification number: H03H7/46 , H01G4/00 , H01G4/02 , H01G7/00 , H03H7/0115 , H03H2001/0014 , H05K1/181 , Y10T29/417 , Y10T29/43
Abstract: A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.
Abstract translation: 提出了一种高功率，低无源互调电容器，其使用金属覆层基板形成，其通过薄的气隙广泛耦合。 每个基板可以包括固定在两侧的金属层，其电耦合在一起以形成单个电容器板，或者每个基板可以在邻近气隙的表面上仅具有单个金属层。 该电容器在低成本RF和微波滤波器中具有特殊应用，可用于通信设备和通信测试设备（如双工器），用于低PIM应用。
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