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公开(公告)号：US20210341157A1
公开(公告)日：2021-11-04
申请号：US17273535
申请日：2019-07-29
Inventor： Kim Choon NG , Muhammad Wakil SHAHZAD , Muhammad BURHAN , Doskhan YBYRAIYMKUL , Seung Jin OH
Abstract: A cooling system for cooling an enclosure, the cooling system including a heat exchange section configured to transfer sensible heat; a humidifier located outside the heat exchange section and configured to humidify a working air stream C so that it transfers latent heat; an air moving system configured to move various air streams through the cooling system; and a piping system configured to connect the heat exchange section to the humidifier and the air moving system. The sensible heat transfer is decoupled from the latent heat transfer.
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