公开(公告)号：US20200249585A1

公开(公告)日：2020-08-06

申请号：US16349089

申请日：2019-04-10

Applicant: KLA-TENCOR CORPORATION

Inventor： Mark GHINOVKER

IPC: G03F7/20 ,  H01L21/66 ,  G03F9/00

Abstract: A target for use in the optical measurement of misregistration in the manufacture of semiconductor devices, the target including a first periodic structure formed on a first layer of a semiconductor device and having a first pitch along an axis and a second periodic structure formed on a second layer of the semiconductor device and having a second pitch along the axis, different from the first pitch, the second periodic structure extending beyond the first periodic structure along the axis.

公开(公告)号：US20160179017A1

公开(公告)日：2016-06-23

申请号：US15057723

申请日：2016-03-01

Applicant: KLA-TENCOR CORPORATION

Inventor： Raviv YOHANAN ,  Eran AMIT ,  Mark GHINOVKER ,  Tal ITZKOVICH ,  Nuriel AMIR

IPC: G03F7/20 ,  G06F17/50 ,  G02B27/42

Abstract: Imaging metrology targets and methods are provided, which combine one-dimensional (1D) elements designed to provide 1D imaging metrology signals along at least two measurement directions and two-dimensional (2D) elements designed to provide at least one 2D imaging metrology overlay signal. The target area of the 1D elements may enclose the 2D elements or the target areas of the 1D and 2D elements may be partially or fully congruent. The compound targets are small, possible multilayered, and may be designed to be process compatible (e.g., by segmentation of the elements, interspaces between elements and element backgrounds) and possibly be produced in die. 2D elements may be designed to periodic to provide additional one dimensional metrology signals.

Abstract translation: 提供成像测量目标和方法，其组合一维（1D）元件，其被设计用于沿着至少两个测量方向提供1D成像测量信号，以及设计成提供至少一个2D成像测量覆盖信号的二维（2D）元件。 1D元件的目标区域可以包围2D元素，或者1D和2D元素的目标区域可以是部分或完全一致的。 复合靶是小的，可能的多层，并且可以被设计为与工艺相容（例如，通过元件的分割，元件和元件背景之间的间隙）并且可能在裸片中产生。 2D元件可被设计成周期性地提供额外的一维计量信号。