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公开(公告)号：US10473454B1
公开(公告)日：2019-11-12
申请号：US15861894
申请日：2018-01-04
Applicant: KLA-Tencor Corporation
Inventor： Yiwu Ding
Abstract: A height mapping system includes a controller configured to generate a height map of a region of interest of a sample with a first optical metrology system having a first numerical aperture, receive images of features having known three-dimensional shapes at selected image plane locations from a second optical metrology system having a second numerical aperture larger than the first numerical aperture, calculate distances between the imaging plane locations and peaks of the features based on in-focus portions of the images and the known three-dimensional shapes, determine distances between the imaging plane locations and a surface of the sample for the features based on the height map, and determine heights of the features by combining the distances between the imaging plane locations and peaks of the features with the distances between the imaging plane locations and the surface of the sample for the one or more features.
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公开(公告)号：US10402963B2
公开(公告)日：2019-09-03
申请号：US15803091
申请日：2017-11-03
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang , Yiwu Ding
Abstract: Defect detection on transparent or translucent wafers can be performed on a die using references from the same die. A first calculated value based on a kernel size, such as a moving mean, is determined. A first difference is determined by subtracting the first calculated value from a pixel intensity. Candidate pixels with a first difference above a threshold are classified. A second calculated value based on a kernel size, such as a local median, is determined. A second difference is determined by subtracting the second calculated value from the pixel intensity. Pixels that include a defect are classified when the second difference is above the threshold.
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公开(公告)号：US20190066284A1
公开(公告)日：2019-02-28
申请号：US15803091
申请日：2017-11-03
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang , Yiwu Ding
CPC classification number: G06T7/001 , G06K9/00 , G06T5/50 , G06T7/136 , G06T7/55 , G06T2207/10056 , G06T2207/20152 , G06T2207/20224
Abstract: Defect detection on transparent or translucent wafers can be performed on a die using references from the same die. A first calculated value based on a kernel size, such as a moving mean, is determined. A first difference is determined by subtracting the first calculated value from a pixel intensity. Candidate pixels with a first difference above a threshold are classified. A second calculated value based on a kernel size, such as a local median, is determined. A second difference is determined by subtracting the second calculated value from the pixel intensity. Pixels that include a defect are classified when the second difference is above the threshold.
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