公开(公告)号：US20190318978A1

公开(公告)日：2019-10-17

申请号：US16386102

申请日：2019-04-16

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Byung Jin CHO ,  Gyusoup LEE ,  Choong Sun KIM ,  Yong Jun KIM ,  Seongho KIM ,  Hyeongdo CHOI

IPC: H01L23/373 ,  H01L35/28 ,  H01L23/367

Abstract: Provided is a flexible heat sink for a flexible thermoelectric device including a first metal thin film; a phase change layer including a highly conductive foam formed on the first metal thin film and a phase change material filling pores of the highly conductive foam; and a second metal thin film formed on the phase change layer. The flexible heat sink for a flexible thermoelectric device has excellent flexibility, a high heat absorption rate, and a small size for heat sinking performance.