利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.029 秒)

    Process for preparing polyamideimide resins by direct polymerization
    3.
    发明授权
    Process for preparing polyamideimide resins by direct polymerization 失效
    通过直接聚合制备聚酰胺酰亚胺树脂的方法

    公开(公告)号：US5955568A

    公开(公告)日：1999-09-21

    申请号：US956923

    申请日：1997-10-23

    申请人： Kil-Yeong Choi ,  Dong-Hack Suh ,  Mi-Hie Yi ,  Young-Taik Hong ,  Moon-Young Jin

    发明人： Kil-Yeong Choi ,  Dong-Hack Suh ,  Mi-Hie Yi ,  Young-Taik Hong ,  Moon-Young Jin

    IPC分类号： C08G73/14 ,  C08G69/28

    CPC分类号： C08G73/14

    摘要： The disclosure describes a process for preparing a polyamideimide resin having high molecular weight in a simple manner wherein major problems of the prior processes such as low heat resistance and low melt flowability are improved. The process comprises condensation of an aromatic tricarboxylic acid anhydride and an aromatic diamine in a polar solvent, subjecting the resulting diimidedicarboxylic acid to acyl halogenating agent treatment to give an intermediate having good reactivity at low temperature, and then subjecting the latter to direct polymerization by using diamine as a nucleophilic agent to give a polyamideimide resin having high molecular weight. The polyamideimide resin prepared by the present invention can be used as major heat resistant structural material in advanced industries and as paint, sheet, adhesives, sliding material, fiber and film having heat resistance.

    摘要翻译： 本公开内容描述了以简单的方式制备具有高分子量的聚酰胺酰亚胺树脂的方法，其中诸如低耐热性和低熔融流动性的现有方法的主要问题得到改善。 该方法包括在极性溶剂中将芳族三羧酸酐和芳族二胺缩合，将所得二酰亚胺二羧酸进行酰卤处理，得到在低温下具有良好反应性的中间体，然后使用后者通过使用 二胺作为亲核剂，得到具有高分子量的聚酰胺酰亚胺树脂。 本发明制备的聚酰胺酰亚胺树脂可用作先进工业中的主要耐热结构材料，可用作具有耐热性的油漆，片材，粘合剂，滑动材料，纤维和薄膜。

    Soluble polyimide resin having a dialkyl substituent for a liquid crystal alignment layer, the monomers and manufacturing methods thereof
    4.
    发明授权
    Soluble polyimide resin having a dialkyl substituent for a liquid crystal alignment layer, the monomers and manufacturing methods thereof 失效
    具有用于液晶取向层的二烷基取代基的可溶性聚酰亚胺树脂，其单体及其制造方法

    公开(公告)号：US06162893A

    公开(公告)日：2000-12-19

    申请号：US138377

    申请日：1998-08-24

    申请人： Kil-Yeong Choi ,  Mi-Hie Yi ,  Moon-Young Jin ,  Jin-Tae Jung ,  Jae-Geun Park ,  Dae-Woo Ihm

    发明人： Kil-Yeong Choi ,  Mi-Hie Yi ,  Moon-Young Jin ,  Jin-Tae Jung ,  Jae-Geun Park ,  Dae-Woo Ihm

    IPC分类号： C08G73/10 ,  G02F1/1337 ,  A61K38/17

    CPC分类号： C08G73/1078 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/1071 ,  G02F1/133723

    摘要： The invention herein relates to a soluble polyimide resin having a dialkyl substituent for a liquid alignment layer, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having a dialkyl substituent are used to yield said soluble polyimide resin which has superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity. According to the present invention, the soluble polyimide polymer having a dialkyl substituent, for a liquid crystal alignment layer, comprising the following a repetitive unit of formula 1: ##STR1## Consequently, the polyimide resin under the present invention not only has superior heat-resistance but also excellent solubility and transparency, which could be applicable as a liquid crystal alignment layer for the TFT-LCD requiring a low temperature processing. Further, the invention has the effects of providing a polyimide resin with superior physical property for heat-resistance structural material, and the monomer therein, in addition to the manufacturing methods thereof.

    摘要翻译： 本发明涉及具有用于液体取向层的二烷基取代基的可溶性聚酰亚胺树脂，其中使用具有二烷基取代基的脂族四羧酸二酐和芳族二胺，得到所述可溶性聚酰亚胺树脂，其具有优异的耐热性，溶解性，透明性和 液晶对准能力。 根据本发明，用于液晶取向层的具有二烷基取代基的可溶性聚酰亚胺聚合物包含以下式1的重复单元：因此，本发明的聚酰亚胺树脂不仅具有优异的耐热性，而且 优异的溶解性和透明性，其可以用作需要低温加工的TFT-LCD的液晶取向层。 此外，除了其制造方法之外，本发明还具有提供对耐热结构材料及其单体具有优异物理性质的聚酰亚胺树脂的效果。

    Soluble polyimide resin having alkoxy substituents and the preparation method thereof
    5.
    发明授权
    Soluble polyimide resin having alkoxy substituents and the preparation method thereof 失效
    具有烷氧基取代基的可溶性聚酰亚胺树脂及其制备方法

    公开(公告)号：US6046303A

    公开(公告)日：2000-04-04

    申请号：US151722

    申请日：1998-09-11

    申请人： Kil-Yeong Choi ,  Mi-Hie Yi ,  Moon-Young Jin ,  Jin-Tae Jung ,  Jeong-Ghi Koo ,  Jae-Eun Cho

    发明人： Kil-Yeong Choi ,  Mi-Hie Yi ,  Moon-Young Jin ,  Jin-Tae Jung ,  Jeong-Ghi Koo ,  Jae-Eun Cho

    IPC分类号： G02F1/1337 ,  C08G73/10

    CPC分类号： C08G73/10 ,  C08G73/1042 ,  G02F1/133723

    摘要： The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the manufacturing method thereof, wherein a mixture of aliphatic tetracarboxylic acid dianhydrides and aromatic diamine having aliphatic side chains are used to yield a soluble polyimide resin which has superior heat-resistance, solubility, surface hardness, transparency and liquid crystal alignment capacity.The soluble polyimide resin having alkoxy substituents, for a liquid crystal layer, according to the present invention, is manufactured by adding a mixture of dioxotetrahydrofuran 3-methylcyclohexene-1,2-dicarboxylic dianhydride, which is an aliphatic tetracarboxylic acid dianhydride and aromatic tetracarboxylic acid dianhydride to a mixture of aromatic diamine, and said dioxotetrahydrofuran 3-methylcyclohexene- 1,2-dicarboxylic dianhydride is used in the amount of 50 to 99 mol % to the total amount of anhydrides.The polyimide resin according to the present invention not only has superior heat-resistance and mechanical characteristics but also excellent solubility and transparency, which could be applicable as a liquid crystal alignment layer for the TFT-LCD requiring difficult processing condition such as a low temperature and vigorous rubbing processing. Further, the polyimide resin may be useful as basic heat resistant structural materials for advanced industry.

    摘要翻译： 本发明涉及一种用于液晶取向层的可溶性聚酰亚胺树脂及其制造方法，其中使用具有脂肪族侧链的脂肪族四羧酸二酐和芳香族二胺的混合物，得到耐热性优异的可溶性聚酰亚胺树脂 ，溶解度，表面硬度，透明度和液晶取向能力。 通过将作为脂肪族四羧酸二酐的二氧代四氢呋喃-3-甲基环己烯-1,2-二甲酸二酐和芳香族四羧酸的混合物加入本发明的液晶层中，具有烷氧基取代基的可溶性聚酰亚胺树脂 二酐与芳族二胺的混合物和所述二氧四氢呋喃-3-甲基环己烯-1,2-二羧酸二酐的用量相对于酸酐总量为50〜99摩尔％。 根据本发明的聚酰亚胺树脂不仅具有优异的耐热性和机械特性，而且具有优异的溶解性和透明性，其可以应用于需要难处理条件如TFT的LCD-LCD的液晶取向层，如低温和 有力的摩擦加工。 此外，聚酰亚胺树脂可用作先进工业的基础耐热结构材料。

    Soluble polyimide resin for liquid crystal alignment layer and process of preparation of the same
    6.
    发明授权
    Soluble polyimide resin for liquid crystal alignment layer and process of preparation of the same 失效
    用于液晶取向层的可溶性聚酰亚胺树脂及其制备方法

    公开(公告)号：US6013760A

    公开(公告)日：2000-01-11

    申请号：US86385

    申请日：1998-05-29

    申请人： Kil-Yeong Choi ,  Mi-Hie Yi ,  Moon-Young Jin ,  Dae-Woo Ihm ,  Jae-Min Oh

    发明人： Kil-Yeong Choi ,  Mi-Hie Yi ,  Moon-Young Jin ,  Dae-Woo Ihm ,  Jae-Min Oh

    IPC分类号： C08G73/10 ,  G02F1/1337 ,  C08G69/28

    CPC分类号： C08G73/10 ,  G02F1/133723 ,  Y10T428/31721

    摘要： The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the process of preparation of the same, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having the amide group are used to yield a novel form of a polyimide resin having superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance, solubility, liquid crystal alignment property, and high pretilt angle, which is prepared by means of jointly using the aromatic diamine, used for the preparation of the conventional polyimide resin, and the aromatic diamine having a long alkyl chain with a substituted amide group, and reacting the same with various types of carboxylic dianhydride.

    摘要翻译： 本发明涉及用于液晶取向层的可溶性聚酰亚胺树脂及其制备方法，其中使用具有酰胺基的脂族四羧酸二酐和芳族二胺以产生具有优异的耐热性的聚酰亚胺树脂的新型， 电阻，溶解度，透明度和液晶取向能力。 更具体地说，本发明涉及一种新型的聚酰亚胺树脂，其具有优异的耐热性，溶解性，液晶取向性和高预倾角，这是通过共同使用芳族二胺制备的，用于制备常规聚酰亚胺 树脂和具有取代酰胺基的长烷基链的芳族二胺，并使其与各种羧酸二酐反应。