公开(公告)号：US20240160963A1

公开(公告)日：2024-05-16

申请号：US18387230

申请日：2023-11-06

Applicant: Korea Electronics Technology Institute

Inventor： Jae Hoon AN ,  Young Hwan KIM ,  Han Gyeol KIM

IPC: G06N5/04

CPC classification number: G06N5/04

Abstract: There is provided an intelligent BMC for predicting a fault by interworking on-device AI. A fault prediction method of a BMC according to an embodiment includes: collecting monitoring information regarding computing modules installed on a main board; calculating a FOFL from the collected monitoring data; and constructing an AI model related to the calculated FOFL and predicting a FOFL from the monitoring data. Accordingly, a fault occurring in various patterns may be predicted based on monitoring data by interworking with on-device AI.