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公开(公告)号：US06271803B1
公开(公告)日：2001-08-07
申请号：US09345197
申请日：1999-06-30
IPC分类号： H01Q124
摘要： A chip antenna comprising a basic body made of a ceramic material; a first conductor and a second conductor respectively disposed at least either inside or on the surface of the basic body so as to be close to each other; a feeding terminal for applying a voltage to the first conductor disposed on the surface of the basic body and connected to the first conductor; and a grounding terminal disposed on the surface of the basic body and connected to the second conductor.
摘要翻译： 一种芯片天线，包括由陶瓷材料制成的基体; 分别设置在所述基体的内部或表面上以使得彼此靠近的第一导体和第二导体; 馈电端子，用于向布置在基体表面上并连接到第一导体的第一导体施加电压; 以及设置在基体的表面上并连接到第二导体的接地端子。
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公开(公告)号：US6111544A
公开(公告)日：2000-08-29
申请号：US245426
申请日：1999-02-04
申请人： Yujiro Dakeya , Teruhisa Tsuru , Seiji Kanba , Tsuyoshi Suesada
发明人： Yujiro Dakeya , Teruhisa Tsuru , Seiji Kanba , Tsuyoshi Suesada
CPC分类号： H01Q1/243 , H01Q1/38 , H01Q9/0421 , H01Q9/0442
摘要： The invention provides a chip antenna comprising: a substrate made by laminating a plurality of sheet layers made of ceramic; a radiating conductor having substantially planar shape and provided on said substrate; a grounding conductor having substantially planar shape and provided so as to oppose said radiating conductor with said sheet layers interposed in between; a capacitor conductor having substantially planar shape and provided so as to oppose said radiating conductor and said grounding conductor with said sheet layers interposed in between; a first shorting conductor which connects said radiating conductor and said grounding conductor; a second shorting conductor which connects said grounding conductor and said capacitor conductor; a feed terminal connected to said radiating conductor or said capacitor conductor; and a ground terminal connected to said grounding conductor. According to the above a chip antenna, the resonance frequency can be adjusted readily with compact size can be achieved.
摘要翻译： 本发明提供一种芯片天线，包括：通过层叠由陶瓷制成的多个片层制成的基板; 具有基本平面形状且设置在所述基板上的辐射导体; 接地导体，具有基本上平面形状并且设置成与所述辐射导体相对，所述片层介于其间; 具有基本上平面形状并且设置成与所述辐射导体和所述接地导体相对的电容器导体，所述片层插入其间; 连接所述辐射导体和所述接地导体的第一短路导体; 连接所述接地导体和所述电容器导体的第二短路导体; 连接到所述辐射导体或所述电容器导体的馈电端子; 以及连接到所述接地导体的接地端子。 根据上述的芯片天线，可以容易地调整谐振频率，可以实现紧凑的尺寸。
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公开(公告)号：US6075491A
公开(公告)日：2000-06-13
申请号：US78850
申请日：1998-05-14
申请人： Yujiro Dakeya , Teruhisa Tsuru , Seiji Kanba , Tsuyoshi Suesada
发明人： Yujiro Dakeya , Teruhisa Tsuru , Seiji Kanba , Tsuyoshi Suesada
摘要： A chip antenna 10 includes, inside a rectangular-parallelepiped base 11 having barium oxide, aluminum oxide, and silica as main constituents, a conductor 12 wound in a spiral form along the length direction of the base 11, and an LC parallel resonance circuit 13, which is inserted in the intermediate portion of the conductor 12 and which is connected electrically in series with the conductor 12, and includes, on the surface of the base 11, a power-feeding terminal 14 for applying a voltage to the conductor 12. The conductor 12 is separated into a first conductor 121 and a second conductor 122 by the LC parallel resonance circuit 13. The LC parallel resonance circuit 13 is formed of a coil L1, which is an inductance element, and a capacitor C1, which is a capacitance element, which are connected in parallel.
摘要翻译： 芯片天线10包括在具有氧化钡，氧化铝和二氧化硅作为主要成分的矩形平行六面体基座11的内部，沿着基座11的长度方向缠绕成螺旋形的导体12和LC并联谐振电路13 ，其插入导体12的中间部分并与导体12串联电连接，并且在基座11的表面上包括用于向导体12施加电压的供电端子14。 导体12由LC并联谐振电路13分离为第一导体121和第二导体122.LC并联谐振电路13由作为电感元件的线圈L1和作为电感元件的电容器C1 电容元件并联连接。
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公开(公告)号：US5977927A
公开(公告)日：1999-11-02
申请号：US794976
申请日：1997-02-05
摘要： A chip antenna in which correct evaluation and inspection of a conductor can be performed regardless of the state of grounding. The chip antenna has a rectangular-prism-shaped substrate formed of a dielectric material comprising, e.g., barium oxide, aluminum oxide and silica. A copper or copper-alloy conductor is spirally wound within the substrate in the longitudinal direction. A feeding terminal for applying a voltage to the conductor and a free terminal are disposed on the surfaces of the conductor. One end of the conductor is attached to the feeding terminal, while the other end is connected to the free terminal.
摘要翻译： 无论接地状态如何，均可进行正确的导体评估和检查的芯片天线。 芯片天线具有由包括例如氧化钡，氧化铝和二氧化硅的电介质材料形成的矩形棱柱形基板。 铜或铜合金导体沿纵向螺旋缠绕在基板内。 用于向导体施加电压的馈电端子和自由端子设置在导体的表面上。 导体的一端连接到馈电端子，而另一端连接到自由端子。
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5.发明授权Mobile communication apparatus having a selecting plate mounted on circuit board 失效具有安装在电路板上的选择板的移动通信装置
公开(公告)号：US6031731A
公开(公告)日：2000-02-29
申请号：US78079
申请日：1998-05-13
申请人： Tsuyoshi Suesada , Yujiro Dakeyo , Seiji Kanba , Teruhisa Tsuru
发明人： Tsuyoshi Suesada , Yujiro Dakeyo , Seiji Kanba , Teruhisa Tsuru
摘要： A mobile cellular telephone 10 has a case 11 which is formed of frame portions 11a through 11f made of, for example, a reinforced plastic, a non-directional chip antenna 12, a circuit board 13 having the chip antenna 12 on one major surface (first major surface) 13a, and a copper-made reflective plate 14, which serves as means for attenuating a transmission output of the chip antenna 12. The reflecting plate 14 is provided between the circuit board 13 and the frame portion 14e in such a manner that it faces the first major surface 13a of the circuit board 13 with an intervening gap. Also, the reflecting plate 14 is connected to the ground pattern 19.
摘要翻译： 移动式蜂窝电话机10具有壳体11，其由例如由增强塑料制成的框架部分11a至11f形成，非定向芯片天线12，在一个主表面上具有芯片天线12的电路板13 第一主表面）13a和铜制反射板14，其用作衰减芯片天线12的透射输出的装置。反射板14以这种方式设置在电路板13和框架部分14e之间 其面对具有中间间隙的电路板13的第一主表面13a。 此外，反射板14连接到接地图案19。
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公开(公告)号：US5870066A
公开(公告)日：1999-02-09
申请号：US735104
申请日：1996-10-22
摘要： A chip antenna comprising a substrate comprising at least one material selected from dielectric materials and magnetic materials, at least two conductors formed on at least one surface of the substrate or inside the substrate, and at least one feeding terminal provided on the surface of the substrate for applying a voltage to the conductors.
摘要翻译： 一种芯片天线，包括：基板，包括从电介质材料和磁性材料中选择的至少一种材料;至少两个导体，其形成在所述基板的至少一个表面上或所述基板内;以及至少一个馈电端子，设置在所述基板的表面上 用于向导体施加电压。
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公开(公告)号：US5999146A
公开(公告)日：1999-12-07
申请号：US926057
申请日：1997-09-09
申请人： Seiji Kanba , Tsuyoshi Suesada , Teruhisa Tsuru , Harufumi Mandai
发明人： Seiji Kanba , Tsuyoshi Suesada , Teruhisa Tsuru , Harufumi Mandai
摘要： A small-sized antenna device in which the conductor length can be reduced without encountering a reduction in gain. The antenna device is constructed by mounting a main antenna unit on a mounting substrate having a transmission line formed on the upper surface of the mounting substrate and also having a ground electrode formed on the back surface. One end of the transmission line is connected to a feeding terminal of the main antenna unit, and the other end of the transmission line is connected to a radio-frequency circuit of a radio communication device in which the antenna device is installed. The ground electrode is grounded.
摘要翻译： 一种小尺寸的天线装置，其中可以减少导体长度而不会降低增益。 天线装置通过将主天线单元安装在具有形成在安装基板的上表面上的传输线的安装基板上并且还具有形成在背面上的接地电极而构成。 传输线的一端连接到主天线单元的馈电端，并且传输线的另一端连接到其中安装天线装置的无线电通信装置的射频电路。 接地电极接地。
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公开(公告)号：US5949385A
公开(公告)日：1999-09-07
申请号：US798834
申请日：1997-02-12
申请人： Kenji Asakura , Teruhisa Tsuru , Seiji Kanba , Tsuyoshi Suesada
发明人： Kenji Asakura , Teruhisa Tsuru , Seiji Kanba , Tsuyoshi Suesada
摘要： A compact non-directional chip antenna. The chip antenna includes a rectangular-parallelopiped base made of printed circuit boards (specific inductive capacity: about 2 to 6) having a glass epoxy resin or glass fluororesin as main constituents, a conductor, made of copper or a copper alloy, which is wound in the shape of a spiral inside the base along the direction of the length of the base, and a power feeding terminal, for applying a voltage to the conductor, on the surface of the base. One end of the conductor forms a power feeding section and is connected to the power feeding terminal. The other end of the conductor forms a free end inside the base.
摘要翻译： 紧凑型无方向性芯片天线。 芯片天线包括由玻璃环氧树脂或玻璃氟树脂作为主要成分的由印刷电路板（比电感容量：约2至6）制成的矩形平行六面体基底，由铜或铜合金制成的导体，其被缠绕 沿着基座的长度方向的基部内部的螺旋形状，以及用于向导体施加电压的供电端子在基座的表面上。 导线的一端形成供电部，与供电端子连接。 导体的另一端在基座内部形成一个自由端。
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公开(公告)号：US5933116A
公开(公告)日：1999-08-03
申请号：US869942
申请日：1997-06-05
摘要： A miniature chip antenna suitable for use in low-frequency-band mobile communications is disclosed. The chip antenna has a rectangular-prism-shaped base member provided with a mounting surface. Disposed within the base member is a conductor spirally wound along the height of the base member. The base member is formed from e.g., ferrite comprising Ni--Zn having a relative magnetic permeability of 7. The conductor is made from a metal comprising, e.g., Cu, Ni, Ag, Pd, Pt, or Au, and is formed by printing, depositing, laminating or plating. The base member and the conductor are then integrally sintered. A conductor having a rectangular cross section and spirally wound along the height of the base member is thus formed within the base member.
摘要翻译： 公开了一种适用于低频带移动通信的微型芯片天线。 芯片天线具有设置有安装表面的矩形棱柱形基座部件。 设置在基座构件内的是沿着基座构件的高度螺旋地卷绕的导体。 基体由例如具有相对导磁率为7的Ni-Zn的铁素体形成。导体由例如Cu，Ni，Ag，Pd，Pt或Au的金属制成，并通过印刷形成 ，沉积，层压或电镀。 然后将基底构件和导体整体烧结。 因此，在基座部件内形成具有矩形横截面且沿基部高度螺旋地卷绕的导体。
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公开(公告)号：US5973651A
公开(公告)日：1999-10-26
申请号：US931612
申请日：1997-09-16
申请人： Tsuyoshi Suesada , Seiji Kanba , Teruhisa Tsuru
发明人： Tsuyoshi Suesada , Seiji Kanba , Teruhisa Tsuru
摘要： A chip antenna comprising a substrate comprising at least one material selected from a dielectric material and a magnetic material, at least one conductor formed at least one of in the interior of the substrate and on the surface of the substrate, at least one feeding terminal provided on the surface of the substrate and connected to an end of the conductor for applying a voltage to the conductor, and at least one capacitor-forming conductor provided at least one of in the interior of the substrate and on the surface of the substrate and connected to the other end of the conductor. An antenna device comprising an antenna main body and a mounting board for mounting the antenna main body is also disclosed. The antenna main body may have the same configuration as the above-described chip antenna.
摘要翻译： 一种芯片天线，包括包括从电介质材料和磁性材料中选择的至少一种材料的衬底，至少一个导体，其形成在衬底的内部和衬底的表面中的至少一个上，至少一个馈电端子被提供 在基板的表面上并连接到用于向导体施加电压的导体的端部，以及至少一个电容器形成导体，其设置在基板的内部和基板的表面中的至少一个上并连接 到导体的另一端。 还公开了一种包括天线主体和用于安装天线主体的安装板的天线装置。 天线主体可以具有与上述芯片天线相同的配置。
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