Wideband multiple-input multiple-output antenna array with tapered body elements

    公开(公告)号:US12074367B1

    公开(公告)日:2024-08-27

    申请号:US16949351

    申请日:2020-10-26

    申请人: Maxtena, Inc.

    发明人: Milan Lukic

    摘要: Wide band Multiple-Input Multiple-Output (MIMO) antenna arrays include elements that taper from small ends located proximate to ground planes to larger ends which may be extended with vertical walls. Different shapes of tapered elements which exhibit different directivity patterns may be used in the same array and/or elements may be oriented differently such that their directivity patters peak in different directions. Each element is provided with symmetrically or asymmetrically located ground shunted conductors which serve to increase non-uniformity in the azimuthal directivity patterns. The ground shunt conductors are strategically placed to reduce element intercoupling which foster improved MIMO system performance.

    Cone antenna assembly
    6.
    发明授权

    公开(公告)号:US12046799B2

    公开(公告)日:2024-07-23

    申请号:US17594891

    申请日:2019-09-30

    IPC分类号: H01Q1/24 H01Q1/36 H01Q9/04

    CPC分类号: H01Q1/241 H01Q1/36 H01Q9/0407

    摘要: Provided is a cone antenna assembly according to the present invention. The cone antenna assembly comprises: a first substrate; a second substrate which is spaced a certain distance from the first substrate and provided with a ground layer; a cone emitter which is provided between the first substrate and the second substrate and has an upper portion connected to the first substrate, a lower portion connected to the second substrate, and an opening section provided in the upper portion; and an antenna frame which is made of a dielectric material and configured to be fastened to the second substrate together with the cone emitter. The present invention can provide a cone antenna assembly that operates in a wide frequency bandwidth from a low frequency bandwidth to a 5G Sub 6 bandwidth, and enhance the convenience of assembling the cone antenna assembly.

    Cross-talk compensation for gradiometer probes

    公开(公告)号:US12044793B2

    公开(公告)日:2024-07-23

    申请号:US17369280

    申请日:2021-07-07

    申请人: Raytheon Company

    摘要: A system/device, such as a gradiometer probe for detecting RF signals, or for example for explosive detection, has the shape of the coils in its adjustment mechanism that minimizes the cross-talk between the receiver probe (Rx) and the transmitting antenna (Tx) in such a way as to minimize (or reduce) the areas where the distance between the coils during the adjustment is the smallest. Moving coils along the plain of the coils is one mechanism of achieving it. Having the coils of different shapes, e.g., circular receiver and oval transmitter coils, is another. Many shapes are possible, including circular, oval, elliptical, and polygonal, to give a few examples. In some embodiments both of these methods/approaches are combined in a single device.

    CEILING ANTENNA
    10.
    发明公开
    CEILING ANTENNA 审中-公开

    公开(公告)号:US20240222854A1

    公开(公告)日:2024-07-04

    申请号:US17923751

    申请日:2021-12-23

    IPC分类号: H01Q1/36 H01Q1/12 H01Q19/10

    CPC分类号: H01Q1/36 H01Q1/12 H01Q19/104

    摘要: The ceiling antenna includes a reflecting bottom plate, wherein the reflecting bottom plate has a via hole; a supporting plate, wherein the supporting plate is fixed to the reflecting bottom plate, and a plane where the supporting plate is located is perpendicular to a plane where the reflecting bottom plate is located; a radiation oscillator, wherein the radiation oscillator is adhered to the supporting plate, the radiation oscillator includes a first radiator, the first radiator has a grid-line-like structure, and a shape of an outer contour of the first radiator is a rectangle having at least one cut corner; and a connector, wherein the connector is located on one side of the reflecting bottom plate that is away from the radiation oscillator, the via hole exposes a part of area of the connector, and the connector is electrically connected to the radiation oscillator through the via hole.