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公开(公告)号:US20190121407A1
公开(公告)日:2019-04-25
申请号:US15946871
申请日:2018-04-06
Applicant: LG ELECTRONICS INC.
Inventor: Joseph LEE , Sanghoon KIM , Kyungui PARK , Chansin PARK , Jaewoong LEE , Sukwon JANG
IPC: G06F1/20 , H01L23/473 , G06F1/18
Abstract: A mobile terminal includes: a terminal body; a circuit board installed in the terminal body; an electronic device mounted to at least one surface of the circuit board; a shield can installed on the circuit board so as to cover the electronic device, and configured to shield electromagnetic waves generated from the electronic device; and a cooling fluid filled in an inner space defined by the circuit board and the shield can, and configured to cool the electronic device.
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公开(公告)号:US20210135474A1
公开(公告)日:2021-05-06
申请号:US16972297
申请日:2018-07-13
Applicant: LG ELECTRONICS INC.
Inventor: Minhun HA , Hyeongseog KIM , Sanghoon KIM , Chansin PARK , Buyoung YANG , Junhyeong WOO
IPC: H02J7/00
Abstract: Provided is a mobile terminal (electronic device) which, in order to minimize aging of a battery included therein through repeated charging/discharging, comprises: the battery charged by a voltage applied thereto; a monitoring device for monitoring a charging condition of the battery, and a charging frequency of the battery; a battery charger for adjusting the voltage applied to the battery; and a controller for controlling the battery, the monitoring device, and the battery charger, wherein, when the battery is charged in a pre-configured charging condition, the controller controls the monitoring device to adjust the charging frequency in response to the pre-configured charging condition, and controls the battery charger to apply a voltage corresponding to the adjusted charging frequency to the battery.
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公开(公告)号:US20200100389A1
公开(公告)日:2020-03-26
申请号:US16467393
申请日:2016-12-07
Applicant: LG ELECTRONICS INC.
Inventor: Kyungui PARK , Jaewoong LEE , Sanghoon KIM , Joseph LEE , Chansin PARK
Abstract: A mobile terminal including a metal frame; a circuit board including at least one processor chip; a shield member mounted on the circuit board and shielding the at least one processor chip; and a heat pipe including a heat plate part contacting the shield member and a heat transfer unit transferring heat generated by the least one processor. Further, the heat plate part and the heat transfer unit are integrally engaged via a soldering part positioned in an overlapped area between the heat plate part and the heat transfer unit.
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