公开(公告)号：US20200100389A1

公开(公告)日：2020-03-26

申请号：US16467393

申请日：2016-12-07

Applicant: LG ELECTRONICS INC.

Inventor： Kyungui PARK ,  Jaewoong LEE ,  Sanghoon KIM ,  Joseph LEE ,  Chansin PARK

IPC: H05K7/20 ,  H04M1/02 ,  H05K5/00

Abstract: A mobile terminal including a metal frame; a circuit board including at least one processor chip; a shield member mounted on the circuit board and shielding the at least one processor chip; and a heat pipe including a heat plate part contacting the shield member and a heat transfer unit transferring heat generated by the least one processor. Further, the heat plate part and the heat transfer unit are integrally engaged via a soldering part positioned in an overlapped area between the heat plate part and the heat transfer unit.

公开(公告)号：US20190121407A1

公开(公告)日：2019-04-25

申请号：US15946871

申请日：2018-04-06

Applicant: LG ELECTRONICS INC.

Inventor： Joseph LEE ,  Sanghoon KIM ,  Kyungui PARK ,  Chansin PARK ,  Jaewoong LEE ,  Sukwon JANG

IPC: G06F1/20 ,  H01L23/473 ,  G06F1/18

Abstract: A mobile terminal includes: a terminal body; a circuit board installed in the terminal body; an electronic device mounted to at least one surface of the circuit board; a shield can installed on the circuit board so as to cover the electronic device, and configured to shield electromagnetic waves generated from the electronic device; and a cooling fluid filled in an inner space defined by the circuit board and the shield can, and configured to cool the electronic device.