公开(公告)号：US20160181894A1

公开(公告)日：2016-06-23

申请号：US14978844

申请日：2015-12-22

Applicant: LG ELECTRONICS INC.

Inventor： Jundae LEE ,  Jongwon KIM ,  Kyunghoon LEE

IPC: H02K11/33 ,  H02K11/02 ,  H05K1/18 ,  H05K1/09 ,  H05K1/11 ,  H02K11/25 ,  H05K7/20

Abstract: Embodiments provide a printed circuit board including a copper foil layer to form a circuit pattern on a base layer, and an insulation layer laminated on the copper foil layer, and wherein the circuit pattern includes a solder pattern, to which an inverter switch element is soldered to supply drive power to a motor, a heat radiation pattern spaced apart from the solder pattern and to contact with one surface of the inverter switch element so as to absorb and radiate heat in the inverter switch element, a heat circulation pattern, through which the heat absorbed by the heat radiation pattern is circulated, and an element pattern formed on both sides of the heat circulation pattern to allow a thermistor element, a resistance value of which is varied according to the heat, to be soldered to the element pattern.

Abstract translation: 实施例提供了一种印刷电路板，其包括在基底层上形成电路图案的铜箔层和层压在铜箔层上的绝缘层，并且其中电路图案包括焊接图案，逆变器开关元件被焊接到该焊料图案 向马达提供驱动力，与焊料图形间隔开的散热图案，并与逆变器开关元件的一个表面接触，以便吸收和辐射逆变器开关元件中的热量，热循环图案 由热辐射图形吸收的热量循环，并且形成在热循环图案两侧的元件图案，以允许热敏电阻元件（其电阻值根据热量而变化）被焊接到元件图案。