公开(公告)号：US20180241859A1

公开(公告)日：2018-08-23

申请号：US15824132

申请日：2017-11-28

Applicant: LG ELECTRONICS INC.

Inventor： Youngmin CHO ,  Kipyoung KIM ,  Kipoung KIM ,  Youngjik LEE

IPC: H04M1/02 ,  G06F1/16 ,  H04B1/3827 ,  H05K1/14 ,  H05K9/00

Abstract: There is disclosed a mobile terminal comprising a printed circuit board, a chipset comprising a die and connected to the printed circuit board through BGA (Ball Grid Array), and a solder pad array provided in a predetermine region of the printed circuit board, corresponding to the BGA, wherein the solder pad array comprises a NSMD array region provided in a region corresponding to the die and having NSMD pads and a SMD array region provided in an outer region of the NSMD array region and having SMD pads, to solve the disadvantages in impact resistance or heat resistance which might be generated in the chipset mounted printed circuit board structure.

公开(公告)号：US20220201860A1

公开(公告)日：2022-06-23

申请号：US17221334

申请日：2021-04-02

Applicant: LG ELECTRONICS INC.

Inventor： Sanggeun KIM ,  Jungtae SEO ,  Kipoung KIM ,  Inkyu PARK ,  Youngjik LEE ,  Youngkweon KIM

IPC: H05K1/14 ,  H05K1/18 ,  H05K9/00 ,  G06F1/16 ,  H05K1/11 ,  H04B1/3888

Abstract: A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.