公开(公告)号：US20180241859A1

公开(公告)日：2018-08-23

申请号：US15824132

申请日：2017-11-28

Applicant: LG ELECTRONICS INC.

Inventor： Youngmin CHO ,  Kipyoung KIM ,  Kipoung KIM ,  Youngjik LEE

IPC: H04M1/02 ,  G06F1/16 ,  H04B1/3827 ,  H05K1/14 ,  H05K9/00

Abstract: There is disclosed a mobile terminal comprising a printed circuit board, a chipset comprising a die and connected to the printed circuit board through BGA (Ball Grid Array), and a solder pad array provided in a predetermine region of the printed circuit board, corresponding to the BGA, wherein the solder pad array comprises a NSMD array region provided in a region corresponding to the die and having NSMD pads and a SMD array region provided in an outer region of the NSMD array region and having SMD pads, to solve the disadvantages in impact resistance or heat resistance which might be generated in the chipset mounted printed circuit board structure.

公开(公告)号：US20170215273A1

公开(公告)日：2017-07-27

申请号：US15178607

申请日：2016-06-10

Applicant: LG ELECTRONICS INC.

Inventor： Inmu KIM ,  Youngmin CHO ,  Kipyoung KIM

IPC: H05K1/02 ,  H05K1/11 ,  H04B1/3888 ,  H01P3/02

CPC classification number: H05K1/0219 ,  H01P3/02 ,  H01P3/026 ,  H01P3/081 ,  H04B1/3888 ,  H04M1/0266 ,  H04M1/0277 ,  H05K1/0216 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0251 ,  H05K1/115

Abstract: A circuit structure and a mobile terminal having a circuit structure are disclosed. The circuit structure may include two transmission lines that extend in a first direction to transmit a signal, and a guard pattern provided between the two transmission lines. The guard pattern may include a plurality of slots each having an open end and a closed end in a second direction. The guard pattern arranged between the transmission lines may lower cross talk by adjusting mutual capacitance so as to improve signal quality.