公开(公告)号：US20240396468A1

公开(公告)日：2024-11-28

申请号：US18692973

申请日：2022-09-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Seok CHO ,  Won Seok NAM ,  Jae Sam LEE ,  Yun Young JUNG

IPC: H02M7/00 ,  H05K7/20

Abstract: The converter comprises: a first housing having a flow path; a second housing coupled to the first housing; a board located between the first housing and the second housing; and a cooling plate located between the board and the first housing. The cooling plate includes a grounding region electrically connected to a grounding pattern of the board, and a position of the cooling plate is located between the first housing and the second housing and exposed to the outside of the first housing.

公开(公告)号：US20230236478A1

公开(公告)日：2023-07-27

申请号：US18010860

申请日：2021-06-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Ah LEE ,  Joo Young LEE ,  Yong Seok CHO

IPC: G03B17/55 ,  H04N23/51 ,  G03B30/00 ,  H04N5/222

CPC classification number: G03B17/55 ,  H04N23/51 ,  G03B30/00 ,  H04N5/222

Abstract: A camera module comprises: a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing, wherein the shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.

公开(公告)号：US20230129190A1

公开(公告)日：2023-04-27

申请号：US17914496

申请日：2021-03-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Joo Young LEE ,  Sang Ah LEE ,  Yong Seok CHO

IPC: H05K1/14 ,  H05K1/02 ,  H02J7/00

Abstract: A cell balancing module according to an embodiment of the present invention comprises: a main board on which a plurality of cell balancing resistors are mounted; at least one sub-board on which a plurality of cell balancing resistors are mounted and which is formed above the main board while being spaced a predetermined distance apart therefrom; and at least one connector which supports the sub-board to be spaced apart from the main board and electrically connects the sub-board to the main board.

公开(公告)号：US20230194856A1

公开(公告)日：2023-06-22

申请号：US17925196

申请日：2021-05-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Joo Young LEE ,  Sang Ah LEE ,  Yong Seok CHO

IPC: G02B27/00 ,  G02B13/00

CPC classification number: G02B27/0006 ,  G02B13/001

Abstract: An embodiment of the present invention relates to a lens module comprising: a first lens which comprises a center portion including a curved surface and a periphery portion extending from the center portion; an electrode which is disposed on the first lens; and first and second conductive parts which are disposed on the electrode, wherein the first and second conductive parts include first and second surfaces opposite to each other with respect to the center portion therebetween, respectively, and the first and second surfaces are convex toward the center portion.

公开(公告)号：US20220384969A1

公开(公告)日：2022-12-01

申请号：US17758197

申请日：2020-12-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Joo Young LEE ,  Sang Ah LEE ,  Yong Seok CHO

IPC: H01R12/52

Abstract: Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.

公开(公告)号：US20250093754A1

公开(公告)日：2025-03-20

申请号：US18968528

申请日：2024-12-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Ah LEE ,  Joo Young LEE ,  Yong Seok CHO

IPC: G03B17/55 ,  G03B30/00 ,  H04N5/222 ,  H04N23/51

Abstract: A camera module having a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing. The shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.

公开(公告)号：US20230040151A1

公开(公告)日：2023-02-09

申请号：US17790564

申请日：2021-01-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Soo San KIM ,  Sung June PARK ,  Yong Seok CHO

IPC: H05K1/18 ,  H01L25/07 ,  H05K1/02 ,  H01F27/06

Abstract: A substrate module according to an embodiment of the present invention comprises: a first substrate which includes transformer connection part to be connected to terminals of a transformer, at least one second substrate on which a switch module to be connected to the transformer is formed; and a conductive connector which connects the first substrate and the second substrate to each other, wherein the first substrate and the second substrate are arranged by the conductive connector such that a predetermined angle is formed therebetween.