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公开(公告)号:US20250093754A1
公开(公告)日:2025-03-20
申请号:US18968528
申请日:2024-12-04
Applicant: LG INNOTEK CO., LTD.
Inventor: Sang Ah LEE , Joo Young LEE , Yong Seok CHO
Abstract: A camera module having a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing. The shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.
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公开(公告)号:US20230236478A1
公开(公告)日:2023-07-27
申请号:US18010860
申请日:2021-06-24
Applicant: LG INNOTEK CO., LTD.
Inventor: Sang Ah LEE , Joo Young LEE , Yong Seok CHO
Abstract: A camera module comprises: a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing, wherein the shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.
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公开(公告)号:US20230194856A1
公开(公告)日:2023-06-22
申请号:US17925196
申请日:2021-05-10
Applicant: LG INNOTEK CO., LTD.
Inventor: Joo Young LEE , Sang Ah LEE , Yong Seok CHO
CPC classification number: G02B27/0006 , G02B13/001
Abstract: An embodiment of the present invention relates to a lens module comprising: a first lens which comprises a center portion including a curved surface and a periphery portion extending from the center portion; an electrode which is disposed on the first lens; and first and second conductive parts which are disposed on the electrode, wherein the first and second conductive parts include first and second surfaces opposite to each other with respect to the center portion therebetween, respectively, and the first and second surfaces are convex toward the center portion.
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公开(公告)号:US20220384969A1
公开(公告)日:2022-12-01
申请号:US17758197
申请日:2020-12-31
Applicant: LG INNOTEK CO., LTD.
Inventor: Joo Young LEE , Sang Ah LEE , Yong Seok CHO
IPC: H01R12/52
Abstract: Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.
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公开(公告)号:US20230129190A1
公开(公告)日:2023-04-27
申请号:US17914496
申请日:2021-03-26
Applicant: LG INNOTEK CO., LTD.
Inventor: Joo Young LEE , Sang Ah LEE , Yong Seok CHO
Abstract: A cell balancing module according to an embodiment of the present invention comprises: a main board on which a plurality of cell balancing resistors are mounted; at least one sub-board on which a plurality of cell balancing resistors are mounted and which is formed above the main board while being spaced a predetermined distance apart therefrom; and at least one connector which supports the sub-board to be spaced apart from the main board and electrically connects the sub-board to the main board.
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