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公开(公告)号：US20230321921A1
公开(公告)日：2023-10-12
申请号：US18023979
申请日：2021-08-24
Applicant: LINTEC CORPORATION
Inventor： Naoki TAYA , Yuki KAWAHARADA
IPC: B29C65/04
CPC classification number: B29C65/04 , B29K2101/12
Abstract: A molded body includes: a first portion including a first material that contains a first thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field; and a second portion including a second material different from the first material of the first portion.
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