公开(公告)号：US20240010878A1

公开(公告)日：2024-01-11

申请号：US17915059

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Sou MIYATA

IPC: C09J7/30 ,  C09J9/02 ,  C09J123/12 ,  C09J125/08 ,  C09J133/12 ,  C09J11/04 ,  H05B6/46 ,  B32B27/32 ,  B32B27/30 ,  B32B27/36 ,  B32B27/20 ,  B32B27/08

CPC classification number: C09J7/30 ,  C09J9/02 ,  C09J123/12 ,  C09J125/08 ,  C09J133/12 ,  C09J11/04 ,  H05B6/46 ,  B32B27/32 ,  B32B27/302 ,  B32B27/36 ,  B32B27/20 ,  B32B27/08 ,  C09J2301/314 ,  C08K2003/2296

Abstract: A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1−VB 1)/VA1}×100 (Formula 2): Vx2=1(VA2−VB2)/VA2×100

公开(公告)号：US20170121569A1

公开(公告)日：2017-05-04

申请号：US15318383

申请日：2014-06-18

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Yuki NITO ,  Yusuke MIYATAKE

IPC: C09J7/02 ,  B32B7/12 ,  H01L21/683 ,  B32B27/06

CPC classification number: H01L21/6836 ,  B32B7/12 ,  B32B27/06 ,  B32B27/308 ,  B32B27/32 ,  B32B2307/54 ,  C08L23/0869 ,  C09J7/29 ,  C09J2201/122 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2421/006 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2429/006 ,  C09J2431/006 ,  C09J2433/00 ,  C09J2433/006 ,  H01L21/6835 ,  H01L2221/68327 ,  C08L23/12

Abstract: A base film for dicing sheets that is used in a dicing sheet comprising the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film comprises at least a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film for dicing sheets is wound up. The second resin layer has a crystallinity of 28% to 45%, The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film for dicing sheets is 25% to 80%.

公开(公告)号：US20240002711A1

公开(公告)日：2024-01-04

申请号：US18039893

申请日：2021-11-30

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Koji TSUCHIBUCHI

IPC: C09J201/00 ,  C09J11/04

CPC classification number: C09J201/00 ,  C09J11/04 ,  C09J2301/312 ,  C09J2301/304 ,  C09J2301/50

Abstract: A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan δ/ε′r), where tan δ and ε′r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz,


0

公开(公告)号：US20230250316A1

公开(公告)日：2023-08-10

申请号：US18012755

申请日：2021-06-25

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J9/02

CPC classification number: C09J7/35 ,  C09J9/02 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2423/10 ,  C09J2423/04

Abstract: An adhesive agent for high-frequency dielectric heating at least contains a thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field. The thermoplastic resin at least contains a first thermoplastic resin and a second thermoplastic resin. The thermoplastic resin is a silane-modified thermoplastic resin. The second thermoplastic resin is a thermoplastic resin that is not silane-modified.

公开(公告)号：US20230141072A1

公开(公告)日：2023-05-11

申请号：US17915062

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J123/12 ,  C09J11/04

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J123/12 ,  C09J2301/304 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/1242

Abstract: A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.

公开(公告)号：US20240052206A1

公开(公告)日：2024-02-15

申请号：US18039901

申请日：2021-11-30

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J11/04 ,  C09J123/06 ,  C09J9/00 ,  B32B37/12 ,  B32B3/26 ,  B32B7/12 ,  B32B5/02 ,  B32B5/26

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J123/06 ,  C09J9/00 ,  B32B37/12 ,  B32B3/263 ,  B32B7/12 ,  B32B5/02 ,  B32B5/26 ,  C09J2301/408 ,  C09J2400/143 ,  C09J2423/04 ,  B32B2310/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/7376 ,  B32B2307/204 ,  B32B2307/748 ,  B32B2264/1025

Abstract: A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,


TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.  (Numerical Formula 11)



TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)−10 degrees C.  (Numerical Formula 12).

公开(公告)号：US20230321921A1

公开(公告)日：2023-10-12

申请号：US18023979

申请日：2021-08-24

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Yuki KAWAHARADA

IPC: B29C65/04

CPC classification number: B29C65/04 ,  B29K2101/12

Abstract: A molded body includes: a first portion including a first material that contains a first thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field; and a second portion including a second material different from the first material of the first portion.

公开(公告)号：US20230159795A1

公开(公告)日：2023-05-25

申请号：US17915042

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J11/04

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J2301/416 ,  C09J2301/124 ,  C09J2301/408 ,  C09J2301/304

Abstract: A high-frequency dielectric heating adhesive sheet includes: a first adhesive layer; a second adhesive layer; and an intermediate layer located between the first adhesive layer and the second adhesive layer, the first adhesive layer containing a first thermoplastic resin and a first dielectric filler configured to generate heat in response to a high-frequency wave, the second adhesive layer containing a second thermoplastic resin and a second dielectric filler configured to generate heat in response to the high-frequency wave, the intermediate layer containing no dielectric filler in response to the high-frequency wave.

公开(公告)号：US20160297180A1

公开(公告)日：2016-10-13

申请号：US15037537

申请日：2014-11-07

Applicant: LINTEC CORPORATION

Inventor： Junichi NAKAMURA ,  Kentaro MIYAZAKI ,  Naoki TAYA

IPC: B32B27/08 ,  B32B27/32 ,  B32B27/30 ,  C09J7/02

CPC classification number: B32B27/08 ,  B29C48/21 ,  B29K2023/0633 ,  B29K2023/08 ,  B29K2105/0085 ,  B29L2007/008 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B25/08 ,  B32B27/30 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/51 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/29 ,  C09J2201/122 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2400/226 ,  C09J2423/046 ,  C09J2433/006

Abstract: A base film (2) includes an expandable layer (B) laminated on a cutting-fragment suppression layer (A) and having a laminate structure of a plurality of resin-based sublayers. The resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R1) after 5 minutes of 10%-stretching. The resin-based sublayer (B2) other than the resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R2) after 5 minutes of 10%-stretching. The cutting-fragment suppression layer (A) contains a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).

Abstract translation: 基膜（2）包括层压在切割片抑制层（A）上并具有多个树脂基亚层的层叠结构的可膨胀层（B）。 最靠近切割片抑制层（A）设置的树脂基亚层（B1）在10％拉伸5分钟之后具有应力松弛率（R1）。 除了最靠近切割片抑制层（A）设置的树脂基亚层（B1）以外的树脂基亚层（B2）在10％拉伸5分钟之后具有应力松弛率（R2）。 切断片抑制层（A）含有含有芳香族系的环和脂肪族系列系的环和非环状烯烃类树脂中的至少一种的热塑性树脂的含环树脂（a1） a2），其是除含环树脂（a1）以外的烯烃系热塑性树脂。

公开(公告)号：US20230303892A1

公开(公告)日：2023-09-28

申请号：US18012788

申请日：2021-06-25

Applicant: LINTEC Corporation

Inventor： Naoki TAYA

IPC: C09J7/35 ,  C09J7/10 ,  C09J9/02

CPC classification number: C09J7/35 ,  C09J7/10 ,  C09J9/02 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2423/00

Abstract: A high-frequency dielectric heating adhesive sheet includes an adhesive layer that at least contains a thermoplastic resin and a dielectric material that generates heat upon application of a high-frequency electric field. The adhesive layer contains silane-modified polyolefin as the thermoplastic resin, and a melt flow rate (MFR) at 190° C. of the thermoplastic resin is in a range from 2 g/10 min to 50 g/10 min.