公开(公告)号：US06573565B2

公开(公告)日：2003-06-03

申请号：US09362399

申请日：1999-07-28

申请人： Lawrence A. Clevenger ,  Louis L. Hsu ,  Li-Kong Wang ,  Tsomg-Dih Yuan

发明人： Lawrence A. Clevenger ,  Louis L. Hsu ,  Li-Kong Wang ,  Tsomg-Dih Yuan

IPC分类号： H01L2362

CPC分类号： H01L21/76264 ,  H01L21/76283 ,  H01L23/3677 ,  H01L23/3732 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/00

摘要： Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of thermal paths, formed after shallow trench and device fabrication steps are completed, which extend through the buried oxide and provide heat dissipation through to the underlying bulk silicon substrate. The thermal conduction path material is preferably diamond which has high thermal conductivity with low electrical conductivity. A second diamond trench cooling structure, formed after device fabrication has been completed, comprises diamond shallow trenches disposed between the devices and extending through the buried oxide layer. An alternative diamond thermal cooling structure includes a diamond insulation layer deposited over the semiconductor devices in either an SOI or bulk silicon structure. Yet another embodiment comprises diamond sidewalls formed along the device walls in thermal contact with the device junctions to provide heat dissipation through the device junctions to underlying cooling structures. It is also proposed that the foregoing structures, and combinations of the foregoing structures, could be used in conjunction with other known cooling schemes.