公开(公告)号：US20240395986A1

公开(公告)日：2024-11-28

申请号：US18669141

申请日：2024-05-20

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Cheng-Hsien LI ,  Kai Hung CHENG

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/10 ,  H01L33/38

Abstract: A light-emitting element, a manufacturing method thereof, and a package structure are provided. The light-emitting element includes a first semiconductor layer, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a convex lens structure disposed on the second semiconductor layer. The convex lens structure includes a plurality of microlenses. The microlenses and the second semiconductor layer are integrally formed and have the same material. The radius of curvature of one of the microlenses is 0.2 μm to 5.0 μm, and the light-emission angle of the light-emitting element is 100° to 110°.