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    LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20220037569A1

    公开(公告)日：2022-02-03

    申请号：US16944131

    申请日：2020-07-30

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

    IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

    DISPLAY DEVICE
    4.
    发明申请
    DISPLAY DEVICE 有权

    公开(公告)号：US20210367113A1

    公开(公告)日：2021-11-25

    申请号：US16879787

    申请日：2020-05-21

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Hui-Ru WU ,  Jo-Hsiang CHEN ,  Jian-Chin LIANG ,  Ai-Sen LIU

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

    Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

    LIGHT EMITTING DIODE PACKAGING STRUCTURE
    5.
    发明公开
    LIGHT EMITTING DIODE PACKAGING STRUCTURE 审中-公开

    公开(公告)号：US20240194848A1

    公开(公告)日：2024-06-13

    申请号：US18587974

    申请日：2024-02-27

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

    IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

    CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.

    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
    6.
    发明申请
    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL 有权

    公开(公告)号：US20220271251A1

    公开(公告)日：2022-08-25

    申请号：US17663431

    申请日：2022-05-15

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    LIGHT EMITTING DIODE DEVICE
    7.
    发明申请
    LIGHT EMITTING DIODE DEVICE 有权

    公开(公告)号：US20220037571A1

    公开(公告)日：2022-02-03

    申请号：US17383402

    申请日：2021-07-22

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/10 ,  H01L33/22

    Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

    LIGHT EMITTING DEVICE, PACKAGE DEVICE AND METHOD OF LIGHT EMITTING DEVICE MANUFACTURING
    8.
    发明申请
    LIGHT EMITTING DEVICE, PACKAGE DEVICE AND METHOD OF LIGHT EMITTING DEVICE MANUFACTURING 有权

    公开(公告)号：US20210328120A1

    公开(公告)日：2021-10-21

    申请号：US17078098

    申请日：2020-10-23

    Applicant: Lextar Electronics Corporation

    Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Chih-Hao LIN

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/00

    Abstract: A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.

    LIGHT-EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明公开
    LIGHT-EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20230238362A1

    公开(公告)日：2023-07-27

    申请号：US17584799

    申请日：2022-01-26

    Applicant: Lextar Electronics Corporation

    Inventor： Jian-Chin LIANG ,  Chih-Hao LIN ,  Wei-Yuan MA ,  Jo-Hsiang CHEN

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H01L25/0753 ,  H01L33/005 ,  H01L33/62 ,  H01L2933/0066

    Abstract: A light-emitting diode (LED) display device, including a substrate, a de-mura region, a plurality of mounting blocks, a first LED chip array and a second LED chip array, is disclosed. The substrate includes a first region and a second region adjacent to each other. The de-mura region includes part of the first region and part of the second region. The mounting blocks are arranged in the first and the second region as an array, each mounting block including a first and a second mounting part. The first and the second mounting part are connected in parallel. The first LED chip array includes multiple first LED chips. The second LED chip array includes multiple second LED chips. Each first mounting part is arranged on the first side of the corresponding mounting block, and each second mounting part is arranged on the second side of the corresponding mounting block.

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