公开(公告)号：US20210280742A1

公开(公告)日：2021-09-09

申请号：US17033700

申请日：2020-09-26

Applicant: Lextar Electronics Corporation

Inventor： Pei-Shiu TSAI ,  Yi-Ju CHEN ,  Nai-Wei HSU ,  Wei-Chang YU

IPC: H01L33/10 ,  H01L33/62

Abstract: A light-emitting element is provided, including a semiconductor structure, a reflective structure, first and second insulating structures, a conductive structure, and first and second pads. The reflective structure is disposed on the semiconductor structure. The first insulating structure includes first and second protrusions covering first and second portions respectively, and a first recession exposes a third portion between the first and second portions. The conductive structure includes first and second conductive portion. The first conductive portion is disposed on the first protrusion to contact the semiconductor structure. The second conductive portion is disposed on the second protrusion to contact the third portion through the first recession. The first and second pads are respectively disposed on the first and second conductive portions. Each of the structures below the first and second pads are in flat-type bonding to enhance stress resistance.