公开(公告)号：US20250022854A1

公开(公告)日：2025-01-16

申请号：US18747368

申请日：2024-06-18

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Po-Han WU ,  Tsung-Hao SU ,  Wei-Yuan MA

IPC: H01L25/075

Abstract: Provide a micro-light-emitting package includes a first substrate, a plurality of micro-light-emitting diodes (micro-LEDs), a transparent protective layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other. The micro-LEDs are disposed on the upper surface of the first substrate. The micro-LEDs have a first electrode and a second electrode electrically opposite to the first electrode. The transparent protective layer covers the micro-LEDs. The plurality of conductive pads are disposed on the lower surface of the first substrate. The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad. The first conductive pad, the second conductive pad, the third conductive pad respectively electrically connected to the corresponding first electrode of the micro-LEDs. The fourth conductive pad is commonly electrically connected to the second electrode of the plurality of micro-LEDs.