公开(公告)号：US20250022854A1

公开(公告)日：2025-01-16

申请号：US18747368

申请日：2024-06-18

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Po-Han WU ,  Tsung-Hao SU ,  Wei-Yuan MA

IPC: H01L25/075

Abstract: Provide a micro-light-emitting package includes a first substrate, a plurality of micro-light-emitting diodes (micro-LEDs), a transparent protective layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other. The micro-LEDs are disposed on the upper surface of the first substrate. The micro-LEDs have a first electrode and a second electrode electrically opposite to the first electrode. The transparent protective layer covers the micro-LEDs. The plurality of conductive pads are disposed on the lower surface of the first substrate. The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad. The first conductive pad, the second conductive pad, the third conductive pad respectively electrically connected to the corresponding first electrode of the micro-LEDs. The fourth conductive pad is commonly electrically connected to the second electrode of the plurality of micro-LEDs.

公开(公告)号：US20220398973A1

公开(公告)日：2022-12-15

申请号：US17446459

申请日：2021-08-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Chien-Nan YEH ,  Jo-Hsiang CHEN ,  Shih-Lun LAI

IPC: G09G3/32 ,  G09G3/20

Abstract: A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/−1.5˜2 nm).

公开(公告)号：US20220254973A1

公开(公告)日：2022-08-11

申请号：US17666513

申请日：2022-02-07

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Wei-Yuan MA ,  Jo-Hsiang CHEN

IPC: H01L33/62 ,  H01L33/54 ,  H01L27/15 ,  H01L33/00

Abstract: A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

公开(公告)号：US20250015059A1

公开(公告)日：2025-01-09

申请号：US18761831

申请日：2024-07-02

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Chun-Xin YE ,  Jin-Shing TSENG

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/60

Abstract: A light-emitting diode display device is provided. The light-emitting diode display device includes a substrate and a plurality of green units, a plurality of red units, a plurality of blue units, and a plurality of cyan units periodically arranged on the substrate. The quantity of green units is higher than the quantity of red units, the quantity of green units is higher than the quantity of blue units, and the quantity of green units is higher than the quantity of cyan units.

公开(公告)号：US20230178523A1

公开(公告)日：2023-06-08

申请号：US17821210

申请日：2022-08-22

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Wei-Yuan MA ,  Jo-Hsiang CHEN

IPC: H01L25/075

CPC classification number: H01L25/0753

Abstract: A light-emitting diode display panel includes a driving substrate, and a first light-emitting region and a second light-emitting region disposed on the driving substrate. The first light-emitting region has a first region and a second region adjacent to the first region in the first direction. The second light-emitting region is adjacent to the first light-emitting region and has a first corresponding region. The second region is between the first region and the first corresponding region. The light-emitting diode display panel further includes pixels disposed in the first region, the second region, and the first corresponding region. Each pixel includes a first light-emitting unit. The first pitch is between the first light-emitting units in the first region and in the second region. The second pitch is between the first light-emitting units in the second region and the first corresponding region. The first pitch is shorter than the second pitch.

公开(公告)号：US20230074731A1

公开(公告)日：2023-03-09

申请号：US17929714

申请日：2022-09-05

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hsin-Lun SU ,  Min-Che TSAI ,  Jo-Hsiang CHEN

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/62

Abstract: A pixel unit includes a substrate, a wiring layer and three light-emitting elements. The wiring layer includes first electrode wires and second electrode wires. The first electrode wires and the second electrode wires are arranged side by side and separated from each other by a spacing. A first blocking wall structure is at a first end portion of each of the first electrode wires, the first end portion is near the corresponding second electrode wires, and a second blocking wall structure is at a second end portion of each of the second electrode wires, the second end portion is near the corresponding first electrode wires. Three light-emitting elements emit red light, green light and blue light respectively. The light-emitting elements are in a flip chip configuration and are connected to one of the first electrode wires and one of the second electrode wires adjacent to each other respectively.

公开(公告)号：US20220037569A1

公开(公告)日：2022-02-03

申请号：US16944131

申请日：2020-07-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jo-Hsiang CHEN ,  Shih-Lun LAI ,  Min-Che TSAI ,  Jian-Chin LIANG

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US20210367113A1

公开(公告)日：2021-11-25

申请号：US16879787

申请日：2020-05-21

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Hui-Ru WU ,  Jo-Hsiang CHEN ,  Jian-Chin LIANG ,  Ai-Sen LIU

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

公开(公告)号：US20200313052A1

公开(公告)日：2020-10-01

申请号：US16367232

申请日：2019-03-27

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Chun-Peng LIN ,  Chang-Han CHEN ,  Kuang-Neng YANG ,  Cheng-Ta KUO

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62

Abstract: A LED carrier includes a substrate, a conductive layer, an adhesive layer, and a reflector. The conductive layer is disposed on the substrate, and has a bonding portion and an extending portion. The bonding portion has a top surface higher than a top surface of the extending portion. The adhesive layer covers the extending portion of the conductive layer and exposes the bonding portion of the conductive layer. The reflector is disposed over the adhesive layer. The adhesive layer has a hook portion in contact with a corner of the reflector.

公开(公告)号：US20240204159A1

公开(公告)日：2024-06-20

申请号：US18590915

申请日：2024-02-28

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/165 ,  H01L25/167 ,  H01L33/10 ,  H01L33/22 ,  H01L33/54

Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.