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    Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates
    1.
    发明授权
    Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates 有权
    从含铝基材中非金属沉积物的非破坏性选择性沉积去除

    公开(公告)号：US08398779B2

    公开(公告)日：2013-03-19

    申请号：US12709369

    申请日：2010-02-19

    申请人： Liyuan Bao ,  Anbei Jiang ,  Sio On Lo ,  Yukari Nishimura ,  Joseph F. Sommers ,  Samantha S. H. Tan

    发明人： Liyuan Bao ,  Anbei Jiang ,  Sio On Lo ,  Yukari Nishimura ,  Joseph F. Sommers ,  Samantha S. H. Tan

    IPC分类号： B08B3/08

    CPC分类号： C23C16/4407 ,  C23G1/125 ,  Y02P20/582

    摘要： Non-metallic deposits are selectively removed from aluminum containing substrates such as aluminum faceplates using a selective deposition removal (SDR) solution. The SDR solution does not substantially etch the faceplate holes, thereby preserving the hole diameter integrity and increasing the number of times the faceplate may be cleaned or refurbished while remaining within processing hole diameter tolerances. In an embodiment, the SDR solution comprises, in wt % of the solution, 15.5%+/−2% HF or buffered HF acid, 3.8%+/−0.5% NH4F pH buffer, 59.7%+/−5% ethylene glycol, and the balance H2O.

    摘要翻译： 使用选择性沉积去除（SDR）溶液，从含铝底物例如铝面板选择性地除去非金属沉积物。 SDR溶液基本上不蚀刻面板孔，从而保持孔直径的完整性并增加面板在保持在加工孔直径公差范围内可被清洁或翻新的次数。 在一个实施方案中，SDR溶液以重量％的比例包含15.5％±2％HF或缓冲HF酸，3.8％±0.5％NH 4 F pH缓冲液，59.7％±5％乙二醇， 和余量H 2 O。

    NON DESTRUCTIVE SELECTIVE DEPOSITION REMOVAL OF NON-METALLIC DEPOSITS FROM ALUMINUM CONTAINING SUBSTRATES
    2.
    发明申请
    NON DESTRUCTIVE SELECTIVE DEPOSITION REMOVAL OF NON-METALLIC DEPOSITS FROM ALUMINUM CONTAINING SUBSTRATES 有权
    非破坏性选择性沉积物从含铝衬底去除非金属沉积物

    公开(公告)号：US20100218788A1

    公开(公告)日：2010-09-02

    申请号：US12709369

    申请日：2010-02-19

    申请人： Liyuan Bao ,  Anbei Jiang ,  Sio On Lo ,  Yukari Nishimura ,  Joseph F. Sommers ,  Samantha S.H. Tan

    发明人： Liyuan Bao ,  Anbei Jiang ,  Sio On Lo ,  Yukari Nishimura ,  Joseph F. Sommers ,  Samantha S.H. Tan

    IPC分类号： C23G1/02

    CPC分类号： C23C16/4407 ,  C23G1/125 ,  Y02P20/582

    摘要： Non-metallic deposits are selectively removed from aluminum containing substrates such as aluminum faceplates using a selective deposition removal (SDR) solution. The SDR solution does not substantially etch the faceplate holes, thereby preserving the hole diameter integrity and increasing the number of times the faceplate may be cleaned or refurbished while remaining within processing hole diameter tolerances. In an embodiment, the SDR solution comprises, in wt % of the solution, 15.5%+/−2% HF or buffered HF acid, 3.8%+/−0.5% NH4F pH buffer, 59.7%+/−5% ethylene glycol, and the balance H2O.

    摘要翻译： 使用选择性沉积去除（SDR）溶液，从含铝底物例如铝面板选择性地除去非金属沉积物。 SDR溶液基本上不蚀刻面板孔，从而保持孔直径的完整性并增加面板在保持在加工孔直径公差范围内可被清洁或翻新的次数。 在一个实施方案中，SDR溶液以重量％的比例包含15.5％±2％HF或缓冲HF酸，3.8％±0.5％NH 4 F pH缓冲液，59.7％±5％乙二醇， 和余量H 2 O。