APPARATUS AND METHOD OF PROCESSING SUBSTRATE

    公开(公告)号:US20240035166A1

    公开(公告)日:2024-02-01

    申请号:US18108002

    申请日:2023-02-09

    申请人: SEMES CO., LTD.

    IPC分类号: C23F1/00

    CPC分类号: C23F1/00

    摘要: A method of processing a substrate includes an etchant supplying operation of supplying an etchant to a substrate; a puddle operation of, by rotating the substrate at a first rotational speed, forming a liquid film of the etchant supplied to the substrate in a puddle shape; and a thickness adjusting operation of changing a rotational speed of the substrate to a rotational speed different from the first rotational speed to adjust a thickness of the liquid film of the etchant. Using the method, dispersion of the etching rate may be effectively controlled.