公开(公告)号：US20160340788A1

公开(公告)日：2016-11-24

申请号：US15224825

申请日：2016-08-01

Applicant: MEC COMPANY LTD.

Inventor： Masayo KURII ,  Kiyoto TAI ,  Mami NAKAMURA

IPC: C23F1/18 ,  H05K3/00

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.