公开(公告)号：US20200325583A1

公开(公告)日：2020-10-15

申请号：US16753986

申请日：2018-10-11

Applicant: MEC COMPANY., LTD.

Inventor： Kenji Nisie ,  Yuki Oka ,  Tomoko Ichihashi ,  Takuto Fujii

IPC: C23C22/52 ,  B05D1/26 ,  B05D7/14 ,  B05D3/12 ,  C09D11/30

Abstract: An object is to provide, for example, a method for manufacturing a film-forming substrate that can sufficiently improve both bleeding of a resin composition and adhesion between the resin composition and a metal substrate surface. For example, provided is a method for manufacturing a film-forming substrate having a film of a resin composition formed on a metal substrate surface, the method including: an etching step of etching a metal substrate surface with a micro-etching agent; a surface treatment step of bringing the etched metal substrate surface into contact with a surface treatment agent to perform a surface treatment such that a contact angle of water on the surface is 50° or more and 150° or less; and a film forming step of forming a film of a resin composition on the surface-treated metal substrate surface by an inkjet method.