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1.发明公开公开(公告)号：US20230179240A1
公开(公告)日：2023-06-08
申请号：US18104761
申请日：2023-02-01
Applicant: MEDIATEK INC.
Inventor： Jui-Lin Hsu , Hsiang-Yun Chu , Yen-Tso Chen , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
IPC: H04B1/04 , H01P5/10 , H03H7/42 , H04B1/30 , H04B1/3805
CPC classification number: H04B1/0483 , H01P5/10 , H03H7/42 , H04B1/30 , H04B1/3805 , H04B2001/307
Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.
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Patent Agency Ranking
公开(公告)号：US11601147B2
公开(公告)日：2023-03-07
申请号：US17504491
申请日：2021-10-18
Applicant: MEDIATEK INC.
Inventor： Jui-Lin Hsu , Hsiang-Yun Chu , Yen-Tso Chen , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
IPC: H04B1/04 , H01P5/10 , H03H7/42 , H04B1/30 , H04B1/3805
Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
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公开(公告)号：US20220140848A1
公开(公告)日：2022-05-05
申请号：US17504491
申请日：2021-10-18
Applicant: MEDIATEK INC.
Inventor： Jui-Lin Hsu , Hsiang-Yun Chu , Yen-Tso Chen , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
IPC: H04B1/04 , H04B1/30 , H04B1/3805 , H01P5/10 , H03H7/42
Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.
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公开(公告)号：US12028099B2
公开(公告)日：2024-07-02
申请号：US18104761
申请日：2023-02-01
Applicant: MEDIATEK INC.
Inventor： Jui-Lin Hsu , Hsiang-Yun Chu , Yen-Tso Chen , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
IPC: H04B1/04 , H01P5/10 , H03H7/42 , H04B1/30 , H04B1/3805
CPC classification number: H04B1/0483 , H01P5/10 , H03H7/42 , H04B1/30 , H04B1/3805 , H04B2001/307
Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.
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公开(公告)号：US20220140849A1
公开(公告)日：2022-05-05
申请号：US17505605
申请日：2021-10-19
Applicant: MEDIATEK INC.
Inventor： Jui-Lin Hsu , Yen-Tso Chen , Hsiang-Yun Chu , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.
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公开(公告)号：US11695439B2
公开(公告)日：2023-07-04
申请号：US17505605
申请日：2021-10-19
Applicant: MEDIATEK INC.
Inventor： Jui-Lin Hsu , Yen-Tso Chen , Hsiang-Yun Chu , Jen-Hao Cheng , Wei-Hsiu Hsu , Tzu-Chin Lin , Chih-Ming Hung , Jing-Hong Conan Zhan
Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.
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