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公开(公告)号：US20240332286A1
公开(公告)日：2024-10-03
申请号：US18593962
申请日：2024-03-03
Applicant: MEDIATEK INC.
Inventor： Yung-Ju Wen , Bo-Shih Huang
CPC classification number: H01L27/0266 , G05F1/569 , H01L27/0292 , H01L27/0296
Abstract: The present invention provides a power clamp cell including a power clamping circuit, a power routing and a global routing is disclosed. The power routing has at least a first vertical metal line and a first horizontal metal line, and the power routing is implemented by using a first metal layer in semiconductor process. The ground routing has at least a second vertical metal line and a second horizontal metal line, and the ground routing is implemented by using a second metal layer in the semiconductor process.
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