ELECTROSTATIC DISCHARGE CIRCUITS AND METHODS FOR OPERATING THE SAME

    公开(公告)号:US20240355810A1

    公开(公告)日:2024-10-24

    申请号:US18762703

    申请日:2024-07-03

    CPC classification number: H01L27/0266 H02H9/046

    Abstract: The present disclosure provides electrostatic discharge circuits and structures and methods for operating the electrostatic discharge circuits and structures. A circuit includes a first transistor and a second transistor. Each of the first transistor and second transistor includes a drain, a source, and a gate. The drain of the first transistor is connected to a first terminal; the source thereof is connected to receive a first voltage, and the gate thereof is connected to receive a second voltage different from the first voltage. The source and the gate of the second transistor are connected to receive the second voltage, and the drain thereof is connected to the first terminal. In response to the terminal reaching a trigger voltage, the first transistor is configured to be turned on, such that electrostatic charges at the first terminal are configured to be discharged through the first transistor.

    METHOD, CIRCUIT AND APPARATUS FOR PROTECTING POWER SUPPLY OF PCIE CARD, AND MEDIUM

    公开(公告)号:US20240329708A1

    公开(公告)日:2024-10-03

    申请号:US18697441

    申请日:2022-06-28

    Abstract: A method, circuit and apparatus for protecting power supply of a peripheral component interconnect express (PCIE) card, and a medium are provided, card hardware design. When the PCIE card is not completely inserted into a slot of a server, a first power supply and a second power supply are controlled to release electric energy, a controller is controlled; to turn off a first MOS transistor, and a load is charged with the electric energy released by the second power supply. When the PCIE card is completely inserted into the slot of the server, a PRSNT #signal is generated, a second MOS transistor is controlled to be turned on, and the controller is controlled to turn on the first MOS transistor. When the PCIE card is not completely pulled out, the second MOS transistor is controlled to be turned off, and the controller is controlled to turn off the first MOS transistor.

    Bulk switching circuitry
    3.
    发明授权

    公开(公告)号:US12101027B2

    公开(公告)日:2024-09-24

    申请号:US17750932

    申请日:2022-05-23

    CPC classification number: H02M3/1566 H01L27/0266 H02M3/158 H03K17/6871

    Abstract: According to an aspect, there is provided an apparatus comprising: a bulk-controlled switch circuit comprising a first transistor coupled to a load and having a source coupled to a source voltage and a drain coupled to a drain voltage, a second transistor and a third transistor coupled, in parallel with the first transistor, to one another in series between the source voltage and the drain voltage, wherein a bulk of the first transistor is coupled with bulks of the second transistor and the third transistor, wherein a gate of the second transistor is coupled to the source voltage via a first impedance circuit and a gate of the third transistor is coupled to the drain voltage via a second impedance circuit to form a comparator switch controlled by the source voltage and the drain voltage and to dynamically switch a greater one of the source voltage and the drain voltage to the load; a first current generator circuit and a second current generator circuit; a first current mirror circuit biased by the first current generator circuit, responsive to the source voltage, and configured to trigger the second transistor to couple the source voltage to the load when the source voltage is above the drain voltage; a second current mirror circuit biased by the second current generator circuit, responsive to the drain voltage, and configured to trigger the third transistor to couple the drain voltage to the load when the drain voltage is above the source voltage.

    Electrostatic discharge circuits and methods for operating the same

    公开(公告)号:US12094870B2

    公开(公告)日:2024-09-17

    申请号:US18356217

    申请日:2023-07-21

    CPC classification number: H01L27/0266 H02H9/046

    Abstract: The present disclosure provides electrostatic discharge circuits and structures and methods for operating the electrostatic discharge circuits and structures. A circuit includes a first transistor and a second transistor. The first transistor includes a drain, a source, a gate, and a bulk. The drain of the first transistor is connected to a first terminal. The source of the first transistor is connected to receive a first voltage. The gate and the bulk of the first transistor is connected to receive a second voltage. The second transistor includes a drain, a source, a gate, and a bulk. The source, the gate, and the bulk of the second transistor is connected to receive the second voltage. The drain of the second transistor is connected to the first terminal. In response to the terminal reaching a trigger voltage, the first transistor is configured to be turned on.

    Electrostatic Protection Structure and Electrostatic Protection Circuit

    公开(公告)号:US20240170952A1

    公开(公告)日:2024-05-23

    申请号:US17790462

    申请日:2022-03-23

    Abstract: Embodiments of the present disclosure relate to an electrostatic protection structure and an electrostatic protection circuit. The electrostatic protection structure includes: a SCR structure and a trigger structure; the SCR structure includes: a well region of a second conductivity type and a first well of a first conductivity type region, a first-doped region of the first conductivity type, and a first-doped region of the second conductivity type; the trigger structure includes: a first-doped region of the second conductivity type, a second well region of the first conductivity type, a second-doped region of two conductivity types, a third-doped region of the second conductivity type, a fourth-doped region of the second conductivity type, and a first gate electrode. The electrostatic protection structure weakens the positive feedback of the parasitic transistor in the SCR device, improves the anti-latch capability of the device, realizes stronger protection capability, and enhances the reliability of the circuit.

    Integrated circuit with ESD protection

    公开(公告)号:US11990192B2

    公开(公告)日:2024-05-21

    申请号:US17684190

    申请日:2022-03-01

    Inventor: Toshiaki Dozaka

    Abstract: According to one embodiment, an integrated circuit includes a first power supply line, a protection circuit, an internal circuit, a second transistor, and a shutoff control circuit. A first power supply voltage is supplied to the first power supply line. The protection circuit is connected to the first power supply line. The internal circuit includes a first transistor whose breakdown voltage is lower than the first power supply voltage. A drain or a source of the first transistor is connected to the first power supply line. The second transistor is on the first power supply line between the protection circuit and the internal circuit and is configured to switch between conduction and non-conduction states to connect and disconnect the protection circuit and the internal circuit from one another along the first power supply line. The shutoff control circuit is configured to turn off the second transistor during an ESD operation.

    Transistor usage metering through bias temperature instability monitoring

    公开(公告)号:US11961835B2

    公开(公告)日:2024-04-16

    申请号:US17520697

    申请日:2021-11-07

    CPC classification number: H01L27/0266 H01L29/41766

    Abstract: A circuit for monitoring usage of an active field effect transistor (FET) includes the active FET and a reference FET, formed in a same structure as the active FET. The active FET and the reference FET both are pFET or both are nFET, and are stacked on each other at a common gate. The circuit also includes a differential current sense circuit (DCSC) and a plurality of switches for connecting terminals of the FETs to logic voltage, ground voltage, and/or the DCSC. The DCSC is configured to measure and compare currents through each of the active and reference FETs when a threshold voltage is applied to the common gate.

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