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公开(公告)号：US20220328378A1
公开(公告)日：2022-10-13
申请号：US17700571
申请日：2022-03-22
Applicant: MEDIATEK Inc.
Inventor： Bo-Jiun YANG , Wen-Sung HSU , Tai-Yu CHEN , Sheng-Liang KUO , Chia-Hao HSU
Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.
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