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公开(公告)号:US11621316B1
公开(公告)日:2023-04-04
申请号:US17580514
申请日:2022-01-20
Applicant: META PLATFORMS TECHNOLOGIES, LLC
Inventor: Min Hyuk Choi , Cheonhong Kim , Richard Han Soo Cho
IPC: H01L27/12 , H01L27/32 , H01L51/00 , G06F3/041 , H01L21/768
Abstract: A device such as a micro-OLED includes a display element having a display active area disposed over a silicon backplane and a display driver integrated circuit (DDIC) electrically coupled to the display element through at least one contact that extends through the silicon backplane. Through silicon via (TSV) technology may be used to form the contacts. A chip-on-flex architecture may be used to orient and attach the DDIC to the silicon backplane.
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公开(公告)号:US11703709B1
公开(公告)日:2023-07-18
申请号:US17165788
申请日:2021-02-02
Applicant: Meta Platforms Technologies, LLC
Inventor: Jianing Yao , Daozhi Wang , Silvio Grespan , Weihua Gao , Chia-Hsuan Tai , Shizhe Shen , John Robert Volk , Richard Han Soo Cho
IPC: G02F1/1335 , G02F1/13363
CPC classification number: G02F1/133548 , G02F1/133541 , G02F1/133638
Abstract: An optical element includes a linear polarizer layer and a transparent optical layer. The linear polarizer layer includes surfaces waviness and the transparent optical layer smooths the surfaces waves of the linear polarizer layer.
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