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公开(公告)号:US09218989B2
公开(公告)日:2015-12-22
申请号:US13200477
申请日:2011-09-23
申请人: Mark S. Hauhe , Jason G. Milne , Terry C. Cisco , Paul Nahass , George Gould , Nick Zafiropoulos
发明人: Mark S. Hauhe , Jason G. Milne , Terry C. Cisco , Paul Nahass , George Gould , Nick Zafiropoulos
CPC分类号: H01L21/563 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要: A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.
摘要翻译: 电路板组件包括电路板,附接到电路板的芯片和电介质层。 该芯片具有面向电路板并与之隔开的电路。 电介质层包括气凝胶。 在一个实施方案中,气凝胶具有约2.0或更小的介电常数和至少约100psi的压缩强度。