公开(公告)号：US20130075795A1

公开(公告)日：2013-03-28

申请号：US13200477

申请日：2011-09-23

申请人： Mark S. Hauhe ,  Jason G. Milne ,  Terry C. Cisco

发明人： Mark S. Hauhe ,  Jason G. Milne ,  Terry C. Cisco

IPC分类号： H01L29/772 ,  H01L21/56 ,  H01L23/48

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

公开(公告)号：US06967282B2

公开(公告)日：2005-11-22

申请号：US10794491

申请日：2004-03-05

申请人： Samual D. Tonomura ,  Terry C. Cisco ,  Clinton O. Holter

发明人： Samual D. Tonomura ,  Terry C. Cisco ,  Clinton O. Holter

IPC分类号： H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K9/00

CPC分类号： H01L23/552 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/3025 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09681 ,  H01L2924/00

摘要： A hybrid assembly having improved cross talk characteristics includes a substrate having an upper surface. Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons made of an electromagnetic band gap (EBG) material having slow wave characteristics are deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons, also made of an electromagnetic band gap material, are deposited over the insulating material. Semiconductor structures are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.

摘要翻译： 具有改进的串扰特性的混合组件包括具有上表面的基板。 设置上表面的导电路径用于传导高频信号。 由具有慢波特性的电磁带隙（EBG）材料制成的常规多边形沉积在上表面上并形成用于镶嵌上表面的格子。 每个多边形都有一个周边。 多边形沿其周边与邻近的多边形间隔开并用绝缘材料覆盖。 也由电磁带隙材料制成的第二多边形沉积在绝缘材料上。 半导体结构安装在第二多边形上。 半导体结构具有多个与导电路径的电接触。 正多边形可以是六边形，三角形，八边形或形成网格并可以印刷到基底上的任何其他组合。

公开(公告)号：US4288291A

公开(公告)日：1981-09-08

申请号：US38200

申请日：1979-05-11

申请人： Terry C. Cisco ,  Algert G. Grimaila

发明人： Terry C. Cisco ,  Algert G. Grimaila

IPC分类号： G01T3/00 ,  G21C17/108 ,  G21C17/00

CPC分类号： G01T3/006 ,  G21C17/108

摘要： A multi-sensor radiation detection system for removable insertion into a nuclear reactor wherein one conductor of all the sensors is a single, common element. This single common element is contained within a tubular metallic sheath and in cross-section comprises a multiple radial armed metallic conductor having a star shaped cross-section dimensioned to form wedge-shaped compartments throughout the active radiation detecting length of the metallic sheath.

摘要翻译： 用于可拆卸地插入核反应堆的多传感器辐射检测系统，其中所有传感器的一个导体是单个公共元件。 该单一共同元件包含在管状金属护套中，并且在横截面中包括具有星形横截面的多径向武装金属导体，其尺寸设计成在金属护套的整个有效辐射检测长度内形成楔形隔室。

公开(公告)号：US09218989B2

公开(公告)日：2015-12-22

申请号：US13200477

申请日：2011-09-23

申请人： Mark S. Hauhe ,  Jason G. Milne ,  Terry C. Cisco ,  Paul Nahass ,  George Gould ,  Nick Zafiropoulos

发明人： Mark S. Hauhe ,  Jason G. Milne ,  Terry C. Cisco ,  Paul Nahass ,  George Gould ,  Nick Zafiropoulos

IPC分类号： H01L21/56 ,  H01L23/29

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

摘要翻译： 电路板组件包括电路板，附接到电路板的芯片和电介质层。 该芯片具有面向电路板并与之隔开的电路。 电介质层包括气凝胶。 在一个实施方案中，气凝胶具有约2.0或更小的介电常数和至少约100psi的压缩强度。