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公开(公告)号:US06233182B1
公开(公告)日:2001-05-15
申请号:US09403104
申请日:1999-12-15
申请人: Masayuki Satou , Isao Shimizu , Hiroshi Fukiage
发明人: Masayuki Satou , Isao Shimizu , Hiroshi Fukiage
IPC分类号: G11C700
CPC分类号: G11C29/36 , G11C29/006 , G11C29/16
摘要: A test circuit comprised of a microprogram controlled control unit for generating a test pattern (addresses and data) for each memory in accordance with a predetermined algorithm and reading written data, an arithmetic unit, and data determining means for determining the read data and outputting the result of determination is provided over a semiconductor chip equipped with a memory
摘要翻译: 一种测试电路,包括微程序控制控制单元,用于根据预定算法产生每个存储器的测试图案(地址和数据)并读取写入数据,运算单元和数据确定装置,用于确定读取的数据并输出 在配备有存储器的半导体芯片上提供确定结果
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公开(公告)号:US06467056B1
公开(公告)日:2002-10-15
申请号:US09461401
申请日:1999-12-15
申请人: Masayuki Satou , Isao Shimizu , Hiroshi Fukiage
发明人: Masayuki Satou , Isao Shimizu , Hiroshi Fukiage
IPC分类号: G11C2900
CPC分类号: G11C29/36 , G11C29/006 , G11C29/16
摘要: A test circuit comprised of a microprogram controlled control unit for generating a test pattern (addresses and data) for each memory in accordance with a predetermined algorithm and reading written data, an arithmetic unit, and data determining means for determinating the read data and outputting the result of determination is provided over a semiconductor chip equipped with a memory.
摘要翻译: 一种测试电路,包括微程序控制控制单元,用于根据预定算法产生每个存储器的测试图案(地址和数据)并读取写入的数据,算术单元和数据确定装置,用于确定读取的数据并输出 在配备有存储器的半导体芯片上提供确定结果。
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公开(公告)号:US06400173B1
公开(公告)日:2002-06-04
申请号:US09692468
申请日:2000-10-20
申请人: Isao Shimizu , Masayuki Sato , Hiroshi Fukiage
发明人: Isao Shimizu , Masayuki Sato , Hiroshi Fukiage
IPC分类号: G01R3126
CPC分类号: H01L21/6835 , G01R31/2806 , G01R31/2831 , G01R31/2884 , G01R31/2886 , G01R31/31917 , H01L2224/16 , H01L2924/01019 , H01L2924/30105 , H01L2924/3011
摘要: A test circuit is provided on a probe card or a wafer on which semiconductor chips to be tested are formed. The test circuit and each of the semiconductor chips to be tested are electrically connected to each other to perform testing, whereby the test can be carried out without using a tester. Conducting a test in such a wafer stage within an aging device allows the simplification or omission of a test subsequent to packaging.
摘要翻译: 测试电路设置在其上形成有待测试的半导体芯片的探针卡或晶片上。 测试电路和要测试的每个半导体芯片彼此电连接以进行测试,从而可以在不使用测试器的情况下进行测试。 在老化装置内的这种晶片台进行测试允许简化或省略包装后的测试。
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公开(公告)号:US06727723B2
公开(公告)日:2004-04-27
申请号:US10140043
申请日:2002-05-08
申请人: Isao Shimizu , Masayuki Sato , Hiroshi Fukiage
发明人: Isao Shimizu , Masayuki Sato , Hiroshi Fukiage
IPC分类号: G01R3126
CPC分类号: H01L21/6835 , G01R31/2806 , G01R31/2831 , G01R31/2884 , G01R31/2886 , G01R31/31917 , H01L2224/16 , H01L2924/01019 , H01L2924/30105 , H01L2924/3011
摘要: A test circuit is provided on a probe card or a wafer on which semiconductor chips to be tested are formed. The test circuit and each of the semiconductor chips to be tested are electrically connected to each other to perform testing, whereby the test can be carried out without using a tester. Conducting a test in such a wafer stage within an aging device allows the simplification or omission of a test subsequent to packaging.
摘要翻译: 测试电路设置在其上形成有待测试的半导体芯片的探针卡或晶片上。 测试电路和要测试的每个半导体芯片彼此电连接以进行测试,从而可以在不使用测试器的情况下进行测试。 在老化装置内的这种晶片台进行测试允许简化或省略包装后的测试。
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