DOUBLE-PITCH-LAYOUT TECHNIQUES AND APPARATUS THEREOF

    公开(公告)号:US20220165330A1

    公开(公告)日:2022-05-26

    申请号:US17543547

    申请日:2021-12-06

    Applicant: MediaTek Inc.

    Abstract: Examples pertaining to double-pitch layout techniques in designing a memory circuit layout are described. In a memory circuit, a layout of a first column of M×1 one-bit memory cells of an array of memory cells and a layout of a second column of M×1 one-bit memory cells of the array of memory cells are mirrored in horizontal and vertical axes such that a first group of input/output (I/O) pins, which correspond to the first column of M×1 one-bit memory cells, are on a first side of a layout of the array and the second group of I/O pins, which correspond to the second column of M×1 one-bit memory cells, are on a second side opposite the first side of the layout of the array.

    Double-pitch-layout techniques and apparatus thereof

    公开(公告)号:US11222691B2

    公开(公告)日:2022-01-11

    申请号:US16813723

    申请日:2020-03-09

    Applicant: MediaTek Inc.

    Abstract: Examples pertaining to double-pitch layout techniques in designing a memory circuit layout are described. In a memory circuit, a layout of a first column of M×1 one-bit memory cells of an array of memory cells and a layout of a second column of M×1 one-bit memory cells of the array of memory cells are mirrored in horizontal and vertical axes such that a first group of input/output (I/O) pins, which correspond to the first column of M×1 one-bit memory cells, are on a first side of a layout of the array and the second group of I/O pins, which correspond to the second column of M×1 one-bit memory cells, are on a second side opposite the first side of the layout of the array.

    Double-Pitch-Layout Techniques And Apparatus Thereof

    公开(公告)号:US20210280237A1

    公开(公告)日:2021-09-09

    申请号:US16813723

    申请日:2020-03-09

    Applicant: MediaTek Inc.

    Abstract: Examples pertaining to double-pitch layout techniques in designing a memory circuit layout are described. In a memory circuit, a layout of a first column of M×1 one-bit memory cells of an array of memory cells and a layout of a second column of M×1 one-bit memory cells of the array of memory cells are mirrored in horizontal and vertical axes such that a first group of input/output (I/O) pins, which correspond to the first column of M×1 one-bit memory cells, are on a first side of a layout of the array and the second group of I/O pins, which correspond to the second column of M×1 one-bit memory cells, are on a second side opposite the first side of the layout of the array.

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